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For the Inventor, By the Inventor

Zhongli, Taiwan

Chuan-Jin Shiu

USPTO Granted Patents = 14

Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 23(Granted Patents)


Location History:

  • Jhongli, TW (2014)
  • Zhongli, TW (2013 - 2016)
  • Taoyuan, TW (2013 - 2019)

Company Filing History:

goldMedal4 out of 199 
 
Xintec Corporation
 patents
silverMedal10 out of 832,680 
Other
 patents

Years Active: 2013-2019

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14 patents (USPTO):Explore Patents
1. 10388541 - Wafer coating system and method of manufacturing chip package (2019-08-20),
2. 9613904 - Semiconductor structure and manufacturing method thereof (2017-04-04),
3. 9230927 - Method of fabricating wafer-level chip package (2016-01-05),
4. 8900913 - Chip package and method for forming the same (2014-12-02),
5. 8890191 - Chip package and method for forming the same (2014-11-18),
6. 8836134 - Semiconductor stacked package and method of fabricating the same (2014-09-16),
7. 8785956 - Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the same (2014-07-22),
8. 8779452 - Chip package (2014-07-15),
9. 8633558 - Package structure for a chip and method for fabricating the same (2014-01-21),
10. 8604578 - Chip package (2013-12-10),
11. 8575634 - Chip package and method for fabricating the same (2013-11-05),
12. 8536671 - Chip package (2013-09-17),
13. 8431946 - Chip package and method for forming the same (2013-04-30),
14. 8384174 - Chip package (2013-02-26),

Title: Inspiring Innovations: The Indelible Legacy of Chuan-Jin Shiu

Introduction:

Chuan-Jin Shiu, a visionary inventor hailing from Zhongli, TW, is a beacon of inspiration in the world of inventions. His unwavering commitment to excellence and creative ingenuity continue to captivate and motivate the next generation of innovators.

Latest Patents:

Shiu's latest patents include a cutting-edge Wafer Coating System and Method of Manufacturing Chip Package, revolutionizing the semiconductor industry with its innovative design. Additionally, his Semiconductor Structure and Manufacturing Method thereof showcases his prowess in developing advanced technologies that push the boundaries of what is possible in the field.

Career Highlights:

With an impressive portfolio boasting 14 patents, Shiu's contributions to the realm of inventions are nothing short of remarkable. Having worked with prestigious companies such as Xintec Corporation, his expertise and innovative spirit have left an indelible mark on the industry.

Collaborations:

Throughout his illustrious career, Shiu has collaborated with top talents in the field, including Po-Shen Lin and Tsang-Yu Liu. Together, they have spearheaded groundbreaking projects that have redefined the landscape of semiconductor technologies.

Conclusion:

Chuan-Jin Shiu's journey is a testament to the power of passion, perseverance, and relentless pursuit of innovation. His legacy serves as a guiding light for aspiring inventors, showcasing the transformative impact of creativity and dedication in shaping the future of technology.

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