The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2013

Filed:

Jun. 06, 2011
Applicants:

Tsang-yu Liu, Zhubei, TW;

Yu-lin Yen, Zhongli, TW;

Chuan-jin Shiu, Zhongli, TW;

Po-shen Lin, New Taipei, TW;

Inventors:

Tsang-Yu Liu, Zhubei, TW;

Yu-Lin Yen, Zhongli, TW;

Chuan-Jin Shiu, Zhongli, TW;

Po-Shen Lin, New Taipei, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to an embodiment of the invention, a chip package is provided, which includes: a substrate having a first surface and a second surface; an optical device between the first surface and the second surface of the substrate; a protection layer formed on the second surface of the substrate, wherein the protection layer has at least an opening; at least a conducting bump formed in the opening of the protection layer and electrically connected to the optical device; and a light shielding layer formed on the protection layer, wherein the light shielding layer is further extended onto a sidewall of the opening of the protection layer.


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