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For the Inventor, By the Inventor

Taipei, Taiwan

Po-Shen Lin

USPTO Granted Patents = 18 

 

Average Co-Inventor Count = 3.8

ph-index = 3

Forward Citations = 27(Granted Patents)


Location History:

  • Taipei, TW (2013)
  • Jhongli, TW (2014)
  • Zhongli, TW (2014)
  • Taoyuan County, TW (2014 - 2016)
  • New Taipei, TW (2013 - 2021)
  • Taoyuan, TW (2018 - 2023)

Company Filing History:

goldMedal6 out of 219 
 
National Chung Shan Institute of Science and Technology
 patents
silverMedal5 out of 199 
 
Xintec Corporation
 patents
bronzeMedal1 out of 2,459 
 
Wistron Corporation
 patents
4. 6 out of 832,680 
Other
 patents

Years Active: 2013-2023

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18 patents (USPTO):
1. 11633824 - Grinding cavity body of multiple vibration sources (2023-04-25),
2. 11628539 - Multi-dimensional vibration grinding cavity body (2023-04-18),
3. 11065814 - Heating device for additive manufacturing, heating module and manufacturing apparatus therewith (2021-07-20),
4. 10970860 - Character-tracking system and character tracking method (2021-04-06),
5. 10814556 - Additive manufacturing chamber, additive manufacturing module and additive manufacturing apparatus therewith (2020-10-27),
6. 10780504 - Powder recycling system and continuous loss in weight module applied thereto (2020-09-22),
7. 10704726 - Curved flow channel with built-in lattice structure (2020-07-07),
8. 9881959 - Chip package and method of manufacturing the same (2018-01-30),
9. 9426894 - Fabrication method of wiring structure for improving crown-like defect (2016-08-23),
10. 9153528 - Chip package and method for forming the same (2015-10-06),
11. 8900913 - Chip package and method for forming the same (2014-12-02),
12. 8890191 - Chip package and method for forming the same (2014-11-18),
13. 8836134 - Semiconductor stacked package and method of fabricating the same (2014-09-16),
14. 8785956 - Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the same (2014-07-22),
15. 8779557 - Chip package and package wafer with a recognition mark, and method for forming the same (2014-07-15),

Certainly! Here is the article about inventor Po-Shen Lin:

Title: Innovator Spotlight: Po-Shen Lin - Revolutionizing Ultrasonic Grinding Technology

Introduction:

Po-Shen Lin, a renowned inventor based in New Taipei, Taiwan, has made significant contributions to the field of ultrasonic grinding technology. With a total of 18 patents to his name, Lin is a pioneer in developing innovative solutions for precision grinding processes.

Latest Patents:

1. Grinding cavity body of multiple vibration sources: Lin's groundbreaking invention introduces a grinding cavity body equipped with multiple ultrasonic vibration sources. This design enables precise control over macroscopic medium flow, enhancing the performance of abrasives in processing workpieces.

2. Multi-dimensional vibration grinding cavity body: Lin's second patent focuses on a multi-dimensional vibration grinding cavity body. By adjusting amplitudes and frequencies of ultrasonic vibration sources, this technology optimizes the grinding process by creating multi-directional macroscopic flows within the cavity body.

Career Highlights:

Lin has an illustrious career and has worked with prestigious organizations such as the National Chung Shan Institute of Science and Technology. His expertise in ultrasonic technology has led to advancements in precision machining and surface finishing applications.

Collaborations:

Throughout his career, Lin has collaborated with industry experts such as Chuan-Jin Shiu and Chih-Peng Chen. Together, they have shared knowledge and expertise to drive innovation in the field of ultrasonic grinding technology.

Conclusion:

In conclusion, Po-Shen Lin's inventive spirit and dedication to advancing ultrasonic grinding technology have positioned him as a leading figure in the industry. His patented technologies are reshaping the landscape of precision machining, offering more efficient and effective solutions for various industrial applications.

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