The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Aug. 17, 2012
Chuan-jin Shiu, Zhongli, TW;
Po-shen Lin, New Taipei, TW;
Shen-yuan Mao, Zhongli, TW;
Cheng-chi Peng, Zhongli, TW;
Chuan-Jin Shiu, Zhongli, TW;
Po-Shen Lin, New Taipei, TW;
Shen-Yuan Mao, Zhongli, TW;
Cheng-Chi Peng, Zhongli, TW;
Other;
Abstract
An embodiment of the invention provides a method for forming a chip package which includes: providing a substrate having a first surface and a second surface, wherein at least one optoelectronic device is formed in the substrate; forming an insulating layer on the substrate; forming a conducting layer on the insulating layer on the substrate, wherein the conducting layer is electrically connected to the at least one optoelectronic device; and spraying a solution of light shielding material on the second surface of the substrate to form a light shielding layer on the second surface of the substrate.