This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 834,513 Years Active: 2014
Title: Innovations by Shen-Yuan Mao
Introduction
Shen-Yuan Mao is a notable inventor based in Zhongli, Taiwan. He has made significant contributions to the field of chip packaging technology. His innovative approach has led to the development of a unique method for forming chip packages.
Latest Patents
Shen-Yuan Mao holds 1 patent for his invention titled "Chip package and method for forming the same." This patent describes a method that includes providing a substrate with a first and second surface, forming an insulating layer, and creating a conducting layer that is electrically connected to at least one optoelectronic device. Additionally, the method involves spraying a solution of light shielding material on the second surface of the substrate to form a light shielding layer.
Career Highlights
Throughout his career, Shen-Yuan Mao has demonstrated a strong commitment to advancing technology in the semiconductor industry. His work has been recognized for its practical applications and innovative solutions.
Collaborations
Shen-Yuan Mao has collaborated with talented individuals such as Po-Shen Lin and Cheng-Chi Peng. These partnerships have contributed to the success of his projects and innovations.
Conclusion
Shen-Yuan Mao's contributions to chip packaging technology exemplify the spirit of innovation. His patent reflects a significant advancement in the field, showcasing his expertise and dedication to improving technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile