Cheng-Chi Peng

Title: Inventor Cheng-Chi Peng: Innovating Chip Packaging Technologies

Introduction

Cheng-Chi Peng is a notable inventor based in Zhongli, Taiwan, recognized for his contributions to the field of chip packaging technology. With one patent to his name, Peng has made significant strides in enhancing the functionality and efficiency of electronic devices by innovating in the design and manufacturing processes of chip packages.

Latest Patents

Cheng-Chi Peng's patent, titled "Chip package and method for forming the same," embodies a method that revolutionizes the way chip packages are created. The invention outlines a comprehensive process that begins with providing a substrate with a first and second surface, where at least one optoelectronic device is formed. The method includes forming an insulating layer over the substrate and a conducting layer that connects electrically to the optoelectronic device. A unique aspect of Peng's approach is the application of a light shielding layer on the second surface of the substrate, achieved by spraying a solution of light shielding material. This innovation is essential in enhancing the performance and durability of chip packages in various electronic applications.

Career Highlights

Throughout his career, Cheng-Chi Peng has focused on advancing the technology associated with electronic components. His work has led to innovations that pave the way for more efficient manufacturing processes and improved product performance. The successful patenting of his chip package method is a testament to his expertise and innovative thinking in the field.

Collaborations

Peng has collaborated with esteemed colleagues, including Chuan-Jin Shiu and Po-Shen Lin. Their collective efforts in research and development have undoubtedly contributed to the successful realization of Peng's patent and further innovations in chip packaging technology.

Conclusion

Cheng-Chi Peng stands out as a significant figure in the realm of chip packaging innovations. His patent serves as a critical advancement in the field, demonstrating how inventive methods can enhance electronic fabrication processes. With continued collaboration and research, Peng is poised to make even more impactful contributions to the technology industry.