The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
May. 21, 2012
Tsang-yu Liu, Zhubei, TW;
Chia-sheng Lin, Zhongli, TW;
Chia-ming Cheng, New Taipei, TW;
Po-shen Lin, Zhongli, TW;
Tsang-Yu Liu, Zhubei, TW;
Chia-Sheng Lin, Zhongli, TW;
Chia-Ming Cheng, New Taipei, TW;
Po-Shen Lin, Zhongli, TW;
Other;
Abstract
An embodiment of the invention provides a chip package which includes: a substrate, wherein the substrate is diced from a wafer; a device region formed in the substrate; a conducting layer disposed on the substrate and electrically connected to the device region; an insulating layer disposed between the substrate and the conducting layer; and a material layer formed on the insulating layer, wherein the material layer has a recognition mark, and the recognition mark shows position information of the substrate in the wafer before the substrate is diced from the wafer.