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For the Inventor, By the Inventor

Taoyuan, Taiwan

Chia-Sheng Lin

USPTO Granted Patents = 45

Average Co-Inventor Count = 2.3

ph-index = 8

Forward Citations = 177(Granted Patents)


Location History:

  • Chang Hua Hsien, TW (2003)
  • Taichung, TW (2003 - 2005)
  • Pun-Hsin Hsiang, Changhua Hsien, TW (2003 - 2008)
  • Taoyuan County, TW (2012 - 2017)
  • Zhongli, TW (2013 - 2018)
  • Taoyuan, TW (2015 - 2024)

Company Filing History:

goldMedal31 out of 199 
 
Xintec Corporation
 patents
silverMedal14 out of 832,680 
Other
 patents

Years Active: 2003-2024

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45 patents (USPTO):
1. 11973095 - Method for forming chip package with second opening surrounding first opening having conductive structure therein (2024-04-30),
2. 11942563 - Manufacturing method of chip package and chip package (2024-03-26),
3. 11705368 - Manufacturing method of chip package and chip package (2023-07-18),
4. 11450697 - Chip package with substrate having first opening surrounded by second opening and method for forming the same (2022-09-20),
5. 11121031 - Manufacturing method of chip package and chip package (2021-09-14),
6. 10461117 - Semiconductor structure and method for manufacturing semiconductor structure (2019-10-29),
7. 10153237 - Chip package and method for forming the same (2018-12-11),
8. 10109559 - Electronic device package and fabrication method thereof (2018-10-23),
9. 9997473 - Chip package and method for forming the same (2018-06-12),
10. 9947716 - Chip package and manufacturing method thereof (2018-04-17),
11. 9887229 - Sensing chip package and a manufacturing method thereof (2018-02-06),
12. 9881959 - Chip package and method of manufacturing the same (2018-01-30),
13. 9875912 - Chip package and manufacturing method thereof (2018-01-23),
14. 9768223 - Electronics device package and fabrication method thereof (2017-09-19),
15. 9761555 - Passive component structure and manufacturing method thereof (2017-09-12),

Title: The Innovative Journey of Chia-Sheng Lin

Introduction: Chia-Sheng Lin, a distinguished inventor hailing from Taoyuan, Taiwan, has made significant contributions to the field of technology and innovation.

Latest Patents: Chia-Sheng Lin's latest patents focus on cutting-edge advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, Chia-Sheng Lin has worked for various tech companies, leading research teams and spearheading projects that have resulted in groundbreaking inventions in the fields of clean energy and sustainable technology.

Collaborations: Throughout his career, Chia-Sheng Lin has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge-sharing that has led to the successful development of numerous patented technologies.

Conclusion: Chia-Sheng Lin's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and researchers worldwide.

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