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Taoyuan, Taiwan

Chia-Sheng Lin

USPTO Granted Patents = 45

Average Co-Inventor Count = 2.3

ph-index = 8

Forward Citations = 181(Granted Patents)

Location History:

Chang Hua Hsien, TW (2003)
Taichung, TW (2003 - 2005)
Pun-Hsin Hsiang, Changhua Hsien, TW (2003 - 2008)
Taoyuan County, TW (2012 - 2017)
Zhongli, TW (2013 - 2018)
Taoyuan, TW (2015 - 2024)

Company Filing History:

Xintec Corporation

14 out of 832,843

Other

patents

Years Active: 2003-2024

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Areas of Expertise:

Chip Package

Semiconductor Structure

Electronic Device Package

Passive Component Structure

Optical Cover Plate

Wafer Level Array

Fabrication Methods

Separation Apparatus

Cable Tightening Device

Length Adjustment Mechanism

Strap Tightener

Cargo Carrier Device

45 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11973095 - Method for forming chip package with second opening surrounding first opening having conductive structure therein (2024-04-30),

2. 11942563 - Manufacturing method of chip package and chip package (2024-03-26),

3. 11705368 - Manufacturing method of chip package and chip package (2023-07-18),

4. 11450697 - Chip package with substrate having first opening surrounded by second opening and method for forming the same (2022-09-20),

5. 11121031 - Manufacturing method of chip package and chip package (2021-09-14),

6. 10461117 - Semiconductor structure and method for manufacturing semiconductor structure (2019-10-29),

7. 10153237 - Chip package and method for forming the same (2018-12-11),

8. 10109559 - Electronic device package and fabrication method thereof (2018-10-23),

9. 9997473 - Chip package and method for forming the same (2018-06-12),

10. 9947716 - Chip package and manufacturing method thereof (2018-04-17),

11. 9887229 - Sensing chip package and a manufacturing method thereof (2018-02-06),

12. 9881959 - Chip package and method of manufacturing the same (2018-01-30),

13. 9875912 - Chip package and manufacturing method thereof (2018-01-23),

14. 9768223 - Electronics device package and fabrication method thereof (2017-09-19),

15. 9761555 - Passive component structure and manufacturing method thereof (2017-09-12),

Title: The Innovative Journey of Chia-Sheng Lin

Introduction: Chia-Sheng Lin, a distinguished inventor hailing from Taoyuan, Taiwan, has made significant contributions to the field of technology and innovation.

Latest Patents: Chia-Sheng Lin's latest patents focus on cutting-edge advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, Chia-Sheng Lin has worked for various tech companies, leading research teams and spearheading projects that have resulted in groundbreaking inventions in the fields of clean energy and sustainable technology.

Collaborations: Throughout his career, Chia-Sheng Lin has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge-sharing that has led to the successful development of numerous patented technologies.

Conclusion: Chia-Sheng Lin's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and researchers worldwide.

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