The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Dec. 21, 2011
Applicants:
Chia-sheng Lin, Taoyuan County, TW;
Yu-ting Huang, Taoyuan County, TW;
Inventors:
Chia-Sheng Lin, Taoyuan County, TW;
Yu-Ting Huang, Taoyuan County, TW;
Assignee:
Xintec Inc., Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 27/146 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14683 (2013.01); H01L 27/14618 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/48 (2013.01); H01L 24/94 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/13 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48463 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1461 (2013.01);
Abstract
Embodiments provide a chip device package and a method for fabricating thereof. A semiconductor chip has a substrate. A supporting brick is separated from the substrate by a certain distance. A bonding pad having a surface is disposed across the substrate and the supporting brick. A bonding wire is electrically connected to the bonding pad.