The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2013
Filed:
Oct. 21, 2011
Hsin-chih Chiu, New Taipei, TW;
Chia-ming Cheng, Taipei, TW;
Chuan-jin Shiu, Zhongli, TW;
Bai-yao Lou, Hsinchu, TW;
Hsin-Chih Chiu, New Taipei, TW;
Chia-Ming Cheng, Taipei, TW;
Chuan-Jin Shiu, Zhongli, TW;
Bai-Yao Lou, Hsinchu, TW;
Other;
Abstract
An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device disposed at the first surface; a protection layer located on the second surface of the substrate, wherein the protection layer has an opening; a light shielding layer located on the second surface of the substrate, wherein a portion of the light shielding layer extends into the opening of the protection layer; a conducting bump disposed on the second surface of the substrate and filled in the opening of the protection layer; and a conducting layer located between the substrate and the protection layer, wherein the conducting layer electrically connects the optoelectronic device to the conducting bump.