Company Filing History:

4 out of 199

Xintec Corporation

patents

1 out of 40,635

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

10 out of 832,680

Other

patents

Years Active: 2011-2017

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15 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 9761555 - Passive component structure and manufacturing method thereof (2017-09-12),

2. 9449897 - Chip package and method for forming the same (2016-09-20),

3. 9293394 - Chip package and method for forming the same (2016-03-22),

4. 9088206 - Power module and the method of packaging the same (2015-07-21),

5. 9023676 - Wafer packaging method (2015-05-05),

6. 8791768 - Capacitive coupler packaging structure (2014-07-29),

7. 8778798 - Electronic device package and fabrication method thereof (2014-07-15),

8. 8742564 - Chip package and method for forming the same (2014-06-03),

9. 8710680 - Electronic device package and fabrication method thereof (2014-04-29),

10. 8604578 - Chip package (2013-12-10),

11. 8541877 - Electronic device package and method for fabricating the same (2013-09-24),

12. 8431946 - Chip package and method for forming the same (2013-04-30),

13. 8384174 - Chip package (2013-02-26),

14. 8207615 - Chip package and method for fabricating the same (2012-06-26),

15. 7888236 - Semiconductor device and fabrication methods thereof (2011-02-15),

Title: The Innovative Journey of Bai-Yao Lou

Introduction

Bai-Yao Lou is a prominent inventor based in Hsinchu, Taiwan, known for his significant contributions to the field of passive components and chip packaging technologies. With a remarkable portfolio of 15 patents, Lou's work stands at the intersection of innovation and practical application, driving advancements in semiconductor technologies.

Latest Patents

Among his latest innovations, Lou has developed a manufacturing method specifically for passive component structures. This method incorporates several steps beginning with the formation of a protection layer on a substrate. Bond pads are then exposed through openings in the protection layer, followed by the application of a conductive layer. The creation of a patterned photoresist layer and electroplating of copper bumps are key elements in this process. Moreover, another notable patent involves a chip package design that features a semiconductor substrate and various protective layers, ensuring enhanced functionality and reliability for electronic devices.

Career Highlights

Throughout his career, Bai-Yao Lou has contributed to the semiconductor industry while working for firms such as Xintec Corporation. His expertise has allowed him to focus on refining processes and structures critical for modern electronic components. With his extensive understanding of materials and manufacturing methods, Lou has successfully turned innovative ideas into practical solutions.

Collaborations

In his pursuit of innovation, Lou has collaborated with notable professionals such as Chien-Hung Liu and Chia-Ming Cheng. These partnerships have enriched his projects and broadened his research horizons, fostering a collaborative environment where ideas could flourish and yield fruitful results.

Conclusion

Bai-Yao Lou continues to be a driving force in the development of new technologies within the semiconductor sector. His impressive collection of patents not only showcases his ingenuity but also highlights his commitment to enhancing electronic components through innovation. As he forges ahead, the future of his inventions promises to significantly impact the industry landscape.

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