The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2015
Filed:
Jan. 26, 2012
Applicants:
Ho-yin Yiu, KLN, HK;
Chien-hung Liu, New Taipei, TW;
Wei-chung Yang, Pingzhen, TW;
Bai-yao Lou, Hsinchu, TW;
Inventors:
Ho-Yin Yiu, KLN, HK;
Chien-Hung Liu, New Taipei, TW;
Wei-Chung Yang, Pingzhen, TW;
Bai-Yao Lou, Hsinchu, TW;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 27/06 (2006.01); H04B 1/02 (2006.01); H02M 3/155 (2006.01); H02M 3/00 (2006.01); H01F 17/00 (2006.01); H01L 23/64 (2006.01); H01L 25/16 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H02M 3/155 (2013.01); H01F 17/0006 (2013.01); H01L 23/645 (2013.01); H01L 25/165 (2013.01); H02M 3/00 (2013.01); H01F 2017/0046 (2013.01); H01F 2017/0073 (2013.01); H01F 2017/0086 (2013.01); H01L 24/16 (2013.01); H01L 25/072 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A power module includes a substrate; a conductive path layer formed on the substrate with a specific pattern as an inductor; a connection layer being formed on the substrate and electrically connected to a first terminal of the inductor; and a first transistor, electrically mounted on the substrate through the connection layer.