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For the Inventor, By the Inventor

Hong Kong, China

Ho-Yin Yiu

This inventor holds 27 USPTO granted patents and 1 published patent application, primarily in Chip Packaging Technology. Top assignees: Xintec Corporation, Taiwan Semiconductor Manufacturing Comp. Ltd., Other. Active years: 1999-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ho-Yin Yiu. Retrieved from https://idiyas.com/inventor/ho-yin-yiu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 88.9

Average Co-Inventor Count = 4.2

ph-index = 3

Forward Citations = 66(Granted Patents)


Location History:

  • Hong Kong, TW (2004)
  • Jhongli, TW (2015)
  • Hsin-Chu, TW (2001 - 2017)
  • Hong Kong, CN (1999 - 2018)

Company Filing History:

goldMedal15 out of 202 
 
Xintec Corporation
 patents
silverMedal8 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
bronzeMedal4 out of 834,513 
Other
 patents

Years Active: 1999-2018

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Areas of Expertise:
Chip Package
Sensing Device
Redistribution Layer
Fabrication Method
Optical Sensor
Tunneling Diode
Power Module
Electrical Connection
Bond Pad Structure
Integrated Circuits
Stress Buffered
Capacitive Coupler
27 patents (USPTO):Explore Patents
1. 10157875 - Chip package and method for forming the same (2018-12-18),
2. 10056419 - Chip package having chip connected to sensing device with redistribution layer in insulator layer (2018-08-21),
3. 9966358 - Chip package (2018-05-08),
4. 9935148 - Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layer (2018-04-03),
5. 9853074 - Chip scale sensing chip package (2017-12-26),
6. 9831185 - Chip package and fabrication method thereof (2017-11-28),
7. 9812413 - Chip module and method for forming the same (2017-11-07),
8. 9780050 - Method of fabricating chip package with laser (2017-10-03),
9. 9768067 - Chip package and manufacturing method thereof (2017-09-19),
10. 9721911 - Chip package and manufacturing method thereof (2017-08-01),
11. 9640405 - Chip package having a laser stop structure (2017-05-02),
12. 9543233 - Chip package having a dual through hole redistribution layer structure (2017-01-10),
13. 9437478 - Chip package and method for forming the same (2016-09-06),
14. 9406578 - Chip package having extended depression for electrical connection and method of manufacturing the same (2016-08-02),
15. 9088206 - Power module and the method of packaging the same (2015-07-21),

Title: Ho-Yin Yiu: A Pioneer in Chip Package Innovations

Introduction

Ho-Yin Yiu is an esteemed inventor based in Hong Kong, CN, known for his significant contributions to the field of semiconductor packaging. With a remarkable portfolio of 27 patents, Yiu has made substantial advancements in technology that enhance the functionality and performance of electronic devices.

Latest Patents

Ho-Yin Yiu's latest patents include innovative chip packages designed to improve integration and connectivity between components. One notable patent describes a chip package that features a first substrate incorporating a sensing device, while a second substrate contains an integrated circuit device. This design includes a first conductive structure that connects both devices through a redistribution layer, all covered by an insulating layer with a strategically placed hole for electrical access. Another recent patent also details a chip package that includes a sensing device and a first conductive structure, ensuring effective connections with an integrated circuit device. These cutting-edge developments reflect Yiu's commitment to advancing chip packaging technologies.

Career Highlights

Throughout his career, Yiu has been associated with several prestigious companies, including Xintec Corporation and Taiwan Semiconductor Manufacturing Company Limited. His work has been pivotal in driving innovations within these organizations, further establishing his reputation as a leading inventor in the semiconductor industry.

Collaborations

In his professional journey, Ho-Yin Yiu has collaborated with notable colleagues - Chien-Hung Liu and Ying-Nan Wen. These partnerships have fostered a dynamic exchange of ideas, contributing to the successful development of many of Yiu's groundbreaking patents.

Conclusion

Ho-Yin Yiu's extensive array of patents and innovative chip package designs underscore his vital role in the semiconductor sector. His work not only enhances the performance of electronic devices but also paves the way for future innovations in the industry. As technology continues to evolve, Yiu's contributions will likely remain influential in shaping the future of chip packaging.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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