The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2018
Filed:
May. 25, 2016
Xintec Inc., Taoyuan, TW;
Ho-Yin Yiu, KLN, HK;
Ying-Nan Wen, Hsinchu, TW;
Chien-Hung Liu, New Taipei, TW;
Wei-Chung Yang, Taoyuan, TW;
XINTEC INC., Taoyuan, TW;
Abstract
A chip package is provided. The chip package includes a substrate having conductive pads therein and adjacent to a first surface thereof. Chips are attached on a second surface opposite to the first surface of the substrate, and an encapsulation layer covers the chips. First redistribution layers are disposed between the second surface of the substrate and the encapsulation layer, and second redistribution layers are disposed on the encapsulation layer. First conductive structures and second conductive structures are disposed in the encapsulation layer. Each of first and second conductive structures respectively includes at least one bonding ball. The first conductive structures are configured to connect first and second redistribution layers, and the second conductive structures are configured to connect the second redistribution layers and the chip. A method of forming the chip package is also provided.