Company Filing History:

20 out of 199

Xintec Corporation

patents

1 out of 40,635

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

1 out of 9,138

Industrial Technology Research Institute

patents

4. 11 out of 832,680

Other

patents

Years Active: 2001-2018

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33 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 10157875 - Chip package and method for forming the same (2018-12-18),

2. 10140498 - Wafer-level packaging sensing device and method for forming the same (2018-11-27),

3. 10056419 - Chip package having chip connected to sensing device with redistribution layer in insulator layer (2018-08-21),

4. 9966358 - Chip package (2018-05-08),

5. 9935148 - Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layer (2018-04-03),

6. 9831185 - Chip package and fabrication method thereof (2017-11-28),

7. 9812413 - Chip module and method for forming the same (2017-11-07),

8. 9780050 - Method of fabricating chip package with laser (2017-10-03),

9. 9768067 - Chip package and manufacturing method thereof (2017-09-19),

10. 9721911 - Chip package and manufacturing method thereof (2017-08-01),

11. 9640405 - Chip package having a laser stop structure (2017-05-02),

12. 9543233 - Chip package having a dual through hole redistribution layer structure (2017-01-10),

13. 9406578 - Chip package having extended depression for electrical connection and method of manufacturing the same (2016-08-02),

14. 9379072 - Chip package and method for forming the same (2016-06-28),

15. 9281243 - Chip scale package structure and manufacturing method thereof (2016-03-08),

Title: The Innovative Mind of Ying-Nan Wen

Introduction: Ying-Nan Wen is a renowned inventor based in Hsinchu, Taiwan. With a remarkable portfolio of 33 patents, his contributions to the field of semiconductor packaging have made a significant impact on the industry. His latest innovations showcase his expertise and commitment to advancing technology.

Latest Patents: Ying-Nan Wen's recent patents include groundbreaking work in chip packaging and sensing devices. The first, titled "Chip package and method for forming the same," describes a chip package that includes a first substrate with a sensing device and a second substrate with an integrated circuit device. The innovation introduces an insulating layer that effectively encapsulates both substrates, ensuring optimal performance. The second patent, "Wafer-level packaging sensing device and method for forming the same," outlines a method for creating a sensing device. This method features a temporary cover plate and a redistribution layer to enhance electrical connectivity, culminating in a highly efficient assembly process.

Career Highlights: Ying-Nan Wen has made significant strides in his career, particularly during his tenure at Xintec Corporation. His work has propelled advancements in semiconductor technology, leading to more efficient and effective products. His dedication to innovation has earned him recognition in the patent community, as evidenced by his extensive list of patents.

Collaborations: Throughout his career, Ying-Nan Wen has collaborated with notable colleagues such as Chien-Hung Liu and Ho-Yin Yiu. These partnerships have further enriched his work, fostering an environment of creativity and innovation that drives the semiconductor industry forward.

Conclusion: Ying-Nan Wen is a pivotal figure in the realm of semiconductor packaging and sensing devices. His 33 patents reflect a legacy of innovation that continues to shape technology. As he moves forward, his contributions will undoubtedly inspire future advancements and the next generation of inventors.

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Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.