This inventor holds 33 USPTO granted patents and 8 published patent applications, primarily in Chip Packaging Technology. Top assignees: Xintec Corporation, Industrial Technology Research Institute, Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2001-2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Taoyuan, TW (2014)
- Jhongli, TW (2015)
- Hsinchu, TW (2001 - 2018)
Company Filing History:
20 out of 201 
1 out of 9,303 
1 out of 42,810 
Years Active: 2001-2018
Areas of Expertise:
Title: The Innovative Mind of Ying-Nan Wen
Introduction: Ying-Nan Wen is a renowned inventor based in Hsinchu, Taiwan. With a remarkable portfolio of 33 patents, his contributions to the field of semiconductor packaging have made a significant impact on the industry. His latest innovations showcase his expertise and commitment to advancing technology.
Latest Patents: Ying-Nan Wen's recent patents include groundbreaking work in chip packaging and sensing devices. The first, titled "Chip package and method for forming the same," describes a chip package that includes a first substrate with a sensing device and a second substrate with an integrated circuit device. The innovation introduces an insulating layer that effectively encapsulates both substrates, ensuring optimal performance. The second patent, "Wafer-level packaging sensing device and method for forming the same," outlines a method for creating a sensing device. This method features a temporary cover plate and a redistribution layer to enhance electrical connectivity, culminating in a highly efficient assembly process.
Career Highlights: Ying-Nan Wen has made significant strides in his career, particularly during his tenure at Xintec Corporation. His work has propelled advancements in semiconductor technology, leading to more efficient and effective products. His dedication to innovation has earned him recognition in the patent community, as evidenced by his extensive list of patents.
Collaborations: Throughout his career, Ying-Nan Wen has collaborated with notable colleagues such as Chien-Hung Liu and Ho-Yin Yiu. These partnerships have further enriched his work, fostering an environment of creativity and innovation that drives the semiconductor industry forward.
Conclusion: Ying-Nan Wen is a pivotal figure in the realm of semiconductor packaging and sensing devices. His 33 patents reflect a legacy of innovation that continues to shape technology. As he moves forward, his contributions will undoubtedly inspire future advancements and the next generation of inventors.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile