The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Oct. 19, 2016
Applicant:

Xintec Inc., Taoyuan, TW;

Inventors:

Tsang-Yu Liu, Zhubei, TW;

Ying-Nan Wen, Hsinchu, TW;

Chi-Chang Liao, Pingtung City, TW;

Yu-Lung Huang, Taoyuan, TW;

Assignee:

XINTEC INC., Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); G06K 9/00 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/04 (2006.01); H01L 23/08 (2006.01); G06K 19/07 (2006.01); H01L 23/15 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
G06K 9/00013 (2013.01); G06K 19/0716 (2013.01); H01L 21/6835 (2013.01); H01L 21/76895 (2013.01); H01L 21/78 (2013.01); H01L 23/04 (2013.01); H01L 23/08 (2013.01); H01L 23/3135 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/92 (2013.01); H01L 24/94 (2013.01); H01L 21/563 (2013.01); H01L 21/6836 (2013.01); H01L 23/15 (2013.01); H01L 23/291 (2013.01); H01L 23/293 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02313 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/058 (2013.01); H01L 2224/0579 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05669 (2013.01); H01L 2224/11002 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32058 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/92225 (2013.01); H01L 2224/94 (2013.01); H01L 2924/351 (2013.01);
Abstract

A method for forming a sensing device includes providing a first substrate. The first substrate has a first surface and a second surface opposite thereto. A sensing region is adjacent to the first surface. A temporary cover plate is provided on the second surface to cover the sensing region. The method also includes forming a redistribution layer on the second surface and electrically connected to the sensing region. The method further includes removing the temporary cover plate after the formation of the redistribution layer. The first substrate is bonded to a second substrate and a cover plate after the removal of the temporary cover plate so that the first substrate is positioned between the second substrate and the cover plate. In addition, the method includes filling an encapsulating layer between the second substrate and the cover plate to surround the first substrate.


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