The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2017
Filed:
Jan. 13, 2016
Applicant:
Xintec Inc., Taoyuan, TW;
Inventors:
Assignee:
XINTEC INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); H01L 23/3114 (2013.01); H01L 23/3135 (2013.01); H01L 24/94 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 29/0657 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02313 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/94 (2013.01); H01L 2924/00015 (2013.01); H01L 2924/0549 (2013.01); H01L 2924/10156 (2013.01); H01L 2924/15153 (2013.01);
Abstract
A chip module is provided. The chip module includes a chip having an upper surface, a lower surface and a sidewall. The chip includes a signal pad region adjacent to the upper surface. A recess extends from the upper surface toward the lower surface along the sidewall of the chip. A redistribution layer is electrically connected to the signal pad region and extends into the recess. A circuit board is located between the upper surface and the lower surface and extends into the recess. A conducting structure is located in the recess and electrically connects the circuit board to the redistribution layer. A method for forming the chip module is also provided.