The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Dec. 29, 2015
Applicant:

Xintec Inc., Taoyuan, TW;

Inventors:

Ying-Nan Wen, Hsinchu, TW;

Chien-Hung Liu, New Taipei, TW;

Shih-Yi Lee, Taoyuan, TW;

Ho-Yin Yiu, Hsinchu, TW;

Assignee:

XINTEC INC., Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/304 (2006.01); H01L 21/76 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 21/268 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/304 (2013.01); H01L 21/268 (2013.01); H01L 21/6835 (2013.01); H01L 21/76 (2013.01); H01L 21/76802 (2013.01); H01L 21/76898 (2013.01); H01L 21/78 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/13 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A chip package included a chip, a first though hole, a laser stop structure, a first isolation layer, a second though hole and a conductive layer. The first though hole is extended from the second surface to the first surface of the chip to expose a conductive pad, and the laser stop structure is disposed on the conductive pad exposed by the first through hole, which an upper surface of the laser stop structure is above the second surface. The first isolation layer covers the second surface and the laser stop structure, and the first isolation layer has a third surface opposite to the second surface. The second though hole is extended from the third surface to the second surface to expose the laser stop structure, and a conductive layer is on the third surface and extended into the second though hole to contact the laser stop structure.


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