The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Mar. 05, 2014
Applicant:
Xintec Inc., Jhongli, Taoyuan County, TW;
Inventors:
Assignee:
XINTEC INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/48 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 21/561 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An embodiment of the invention provides a chip package which includes: a semiconductor substrate; a device region formed in the semiconductor substrate; at least a conducting pad disposed over a surface of the semiconductor substrate; a protection plate disposed over the surface of the semiconductor substrate; and a spacer layer disposed between the surface of the semiconductor substrate and the protection plate, wherein the protection plate and the spacer layer surround a cavity over the device region, the spacer layer has an outer side surface away from the cavity, and the outer side surface of the spacer layer is not a cutting surface.