The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2011
Filed:
May. 14, 2007
Han-ping Pu, Taichung, TW;
Bai-yao Lou, Hsinchu, TW;
Dean Wang, Tainan, TW;
Ching-wen Hsiao, Taipei, TW;
Kai-ming Ching, Hsinchu, TW;
Chen-cheng Kuo, Hsinchu, TW;
Wen-chih Chiou, Miaoli, TW;
Ding-chung LU, Hsinchu, TW;
Shang-yun Hou, Hsinchu, TW;
Han-Ping Pu, Taichung, TW;
Bai-Yao Lou, Hsinchu, TW;
Dean Wang, Tainan, TW;
Ching-Wen Hsiao, Taipei, TW;
Kai-Ming Ching, Hsinchu, TW;
Chen-Cheng Kuo, Hsinchu, TW;
Wen-Chih Chiou, Miaoli, TW;
Ding-Chung Lu, Hsinchu, TW;
Shang-Yun Hou, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A method for packaging a semiconductor device disclosed. A substrate comprising a plurality of dies, separated by scribe line areas respectively is provided, wherein at least one layer is overlying the substrate. A portion of the layer within the scribe lines area is removed by photolithography and etching to form openings. The substrate is sawed along the scribe line areas, passing the openings. In alternative embodiment, a first substrate comprising a plurality of first dies separated by first scribe line areas respectively is provided, wherein at least one first structural layer is overlying the first substrate. The first structural layer is patterned to form first openings within the first scribe line areas. A second substrate comprising a plurality of second dies separated by second scribe line areas respectively is provided, wherein at least one second structural layer is overlying the substrate. The second structural layer is patterned to form second openings within the second scribe line areas. The first substrate and the second substrate are bonded to form a stack structure. The stack structure is cut along the first and second scribe line areas, passing the first and second openings.