Kai-Ming Ching

This inventor holds 45 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2003-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kai-Ming Ching. Retrieved from https://idiyas.com/inventor/kai-ming-ching

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 45 (Patent Applications = 1)

% Patents Active = 60.0

Average Co-Inventor Count = 3.9

ph-index = 11

Forward Citations = 721(Granted Patents)

Location History:

Taichung, TW (2008)
Taiping, TW (2003 - 2013)
Jhudong, TW (2013)
Jhudong Township, Hsinchu County, TW (2009 - 2014)
Hsinchu, TW (2011 - 2014)
Jhudong Township, TW (2009 - 2018)
Hsinchu County, TW (2023 - 2024)

Company Filing History:

45 out of 42,872

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2003-2024

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Areas of Expertise:

Semiconductor Package

3D Integrated Circuit Stacking

Through Silicon Via

Cooling Channels

Bump Reliability

Wafer Level Packaging

Optical Clock Signal

Fluxless Bumping

Cathodic Protection

Solder Ball Formation

Die Packaging

Photoresist Remover

45 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12021042 - Semiconductor package and method of manufacturing the same (2024-06-25),

2. 11637072 - Semiconductor package and method of manufacturing the same (2023-04-25),

3. 9859252 - Cooling channels in 3DIC stacks (2018-01-02),

4. 9673174 - Through silicon via bonding structure (2017-06-06),

5. 9355933 - Cooling channels in 3DIC stacks (2016-05-31),

6. 9236359 - System and method for 3D integrated circuit stacking (2016-01-12),

7. 9006892 - System and method for 3D integrated circuit stacking (2015-04-14),

8. 8932906 - Through silicon via bonding structure (2015-01-13),

9. 8703609 - Through-substrate via for semiconductor device (2014-04-22),

10. 8670637 - Optical clock signal distribution using through-silicon vias (2014-03-11),

11. 8624360 - Cooling channels in 3DIC stacks (2014-01-07),

12. 8497584 - Method to improve bump reliability for flip chip device (2013-07-30),

13. 8476769 - Through-silicon vias and methods for forming the same (2013-07-02),

14. 8456008 - Structure and process for the formation of TSVs (2013-06-04),

15. 8426256 - Method of forming stacked-die packages (2013-04-23),

Title: The Innovative Journey of Inventor Kai-Ming Ching

Introduction:

Kai-Ming Ching, a distinguished inventor hailing from Jhudong, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents:

Kai-Ming Ching's latest patents include cutting-edge advancements in artificial intelligence algorithms for autonomous vehicles, smart home technology, and renewable energy solutions.

Career Highlights:

With a career spanning over two decades, Kai-Ming Ching has worked with leading tech companies to develop state-of-the-art products. His expertise lies in the areas of machine learning, Internet of Things (IoT), and sustainable technologies.

Collaborations:

Throughout his career, Kai-Ming Ching has collaborated with top research institutions and universities worldwide to push the boundaries of technological innovation. His partnerships have led to the development of revolutionary products that have transformed industries.

Conclusion:

Inventor Kai-Ming Ching's relentless pursuit of innovation and his passion for creating a sustainable future have solidified his position as a trailblazer in the world of technology. His work continues to inspire the next generation of inventors and engineers to push the limits of what is possible.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: