The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2013
Filed:
Feb. 05, 2010
C. W. Hsiao, Banqiao, TW;
Bo-i Lee, Sindian, TW;
Tsung-ding Wang, Tainan, TW;
Kai-ming Ching, Jhudong Township, TW;
Chen-shien Chen, Zhubei, TW;
Chien-hsiun Lee, Hsinchu, TW;
Clinton Chao, Redwood Shores, CA (US);
C. W. Hsiao, Banqiao, TW;
Bo-I Lee, Sindian, TW;
Tsung-Ding Wang, Tainan, TW;
Kai-Ming Ching, Jhudong Township, TW;
Chen-Shien Chen, Zhubei, TW;
Chien-Hsiun Lee, Hsinchu, TW;
Clinton Chao, Redwood Shores, CA (US);
Abstract
A method of forming a stacked die structure is disclosed. A plurality of dies are respectively bonded to a plurality of semiconductor chips on a first surface of a wafer. An encapsulation structure is formed over the plurality of dies and the first surface of the wafer. The encapsulation structure covers a central portion of the first surface of the wafer and leaves an edge portion of the wafer exposed. A protective material is formed over the first surface of the edge portion of the wafer.