Sindian, Taiwan

Bo-I Lee

USPTO Granted Patents = 20 

Average Co-Inventor Count = 2.8

ph-index = 6

Forward Citations = 158(Granted Patents)


Location History:

  • Sindian, TW (2010 - 2020)
  • Taipei County, TW (2022)

Company Filing History:


Years Active: 2010-2022

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20 patents (USPTO):Explore Patents

Title: Innovations by Bo-I Lee: Pioneering Semiconductor Polishing Technologies

Introduction

Bo-I Lee, an accomplished inventor based in Sindian, Taiwan, has made significant strides in the field of semiconductor fabrication. With a remarkable portfolio of 20 patents, he has continuously contributed to advancements in technologies that enhance the efficiency and effectiveness of semiconductor processing.

Latest Patents

Among his latest innovations, Lee has developed an "Apparatus and Method for Chemically Mechanically Polishing." This invention involves a sophisticated apparatus equipped with a movable arm and a conditioner module that alters the roughness of polishing pads, ultimately optimizing the polishing of semiconductor wafers. The unique design allows for the conditioner module to be magnetically coupled to the arm, facilitating easy detachment and manipulation.

Lee's other notable patent is the "Method and Apparatus for Performing a Polishing Process in Semiconductor Fabrication," which outlines a highly effective apparatus for fabricating semiconductor devices. This device integrates a polishing head, a retaining ring, and a spray nozzle, all working together to ensure that the wafers are polished with precision, while also allowing for the cleaning of the bevel region during the process.

Career Highlights

Bo-I Lee currently works at Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), where he plays a pivotal role in the development of innovative semiconductor fabrication technologies. His career has been marked by a commitment to enhancing manufacturing processes, reflecting his expertise in both engineering and material sciences.

Collaborations

Lee collaborates with esteemed colleagues such as Tsung-Ding Wang and Chi-Ming Yang. Together, they are instrumental in pushing the boundaries of semiconductor technology, leveraging their combined knowledge to foster an environment of innovation and advancement.

Conclusion

Through his dedication and inventive spirit, Bo-I Lee continues to lead advancements in semiconductor manufacturing. His patents are not only testaments to his technical skills but also reflect the vital role of innovation in driving the future of this critical industry. As the demand for more efficient semiconductor processing grows, Lee's contributions will undoubtedly remain significant in shaping the landscape of technology.

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