The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Jan. 21, 2016
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Bo-I Lee, Sindian, TW;
Soon-Kang Huang, Hsinchu, TW;
Chi-Ming Yang, Hsinchu, TW;
Chin-Hsiang Lin, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method of planarizing a wafer includes pressing the wafer against a planarization pad. The method further includes moving the planarization pad relative to the wafer. The method further includes conditioning the planarization pad using a pad conditioner. Conditioning the planarization pad includes moving the planarization pad relative to the pad conditioner. The pad conditioner includes abrasive particles having aligned tips a substantially constant distance from a surface of substrate of the pad conditioner.