The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Jul. 22, 2016
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method of forming a semiconductor package includes depositing a passivation layer overlying a semiconductor substrate, wherein the semiconductor substrate includes a scribe line region positioned between a first chip region and a second chip region. The method further includes forming a bump overlying the passivation layer on at least one of the first chip region or the second chip region, wherein the bump comprises a copper pillar and a cap layer. The method further includes forming a groove passing through the passivation layer on the scribe line region, wherein the groove extends into the semiconductor substrate to expose a stepped sidewall of the semiconductor substrate. The method further includes applying a molding compound layer to cover the passivation layer and a lower portion of the bump and fill the groove. The method further includes singulating along the scribe line region.