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For the Inventor, By the Inventor

Tainan, Taiwan

Tsung-Ding Wang

USPTO Granted Patents = 102 

Average Co-Inventor Count = 4.3

ph-index = 12

Forward Citations = 2,104(Granted Patents)

Forward Citations (Not Self Cited) = 2,075(Oct 12, 2025)


Inventors with similar research interests:


Location History:

  • Hsin-Chu, TW (2017 - 2018)
  • Kaohsiung, TW (2018)
  • Tainan, TW (2010 - 2024)

Company Filing History:

goldMedal101 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 10 
 
Parabellum Strategic Opportunities Fund LLC
 patents

Years Active: 2010-2025

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102 patents (USPTO):
1. 12482790 - Packages with stacked dies and methods of forming the same (2025-11-25),
2. 12418982 - Laminated structure with pads and manufacturing method thereof (2025-09-16),
3. 12417968 - Package structure and forming method thereof (2025-09-16),
4. 12412846 - Semiconductor package and methods of fabricating a semiconductor package (2025-09-09),
5. 12362321 - Semiconductor package (2025-07-15),
6. 12345740 - Probe card substrate, substrate structure and method of fabricating the same (2025-07-01),
7. 12218021 - Semiconductor packages and methods of forming the same (2025-02-04),
8. 12199065 - Multi-die package structures including redistribution layers (2025-01-14),
9. 12183682 - Semiconductor package and manufacturing method thereof (2024-12-31),
10. 12142560 - Semiconductor packages and methods of forming same (2024-11-12),
11. 11961777 - Package structure comprising buffer layer for reducing thermal stress and method of forming the same (2024-04-16),
12. 11894341 - Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof (2024-02-06),
13. 11705378 - Semiconductor packages and methods of forming the same (2023-07-18),
14. 11652086 - Packages with stacked dies and methods of forming the same (2023-05-16),
15. 11538761 - Semiconductor package having molded die and semiconductor die and manufacturing method thereof (2022-12-27),

Sure, I can help you with that! Here is the article about inventor Tsung-Ding Wang:

Title: Tsung-Ding Wang: Pioneering Innovations in Technology

Introduction:

Tsung-Ding Wang is a visionary inventor whose dedication to innovation and relentless pursuit of excellence have cemented his position as a trailblazer in the realm of technology. His work continues to inspire and shape the future of sustainable energy solutions, leaving a lasting legacy in the world of inventions.

Latest Patents:

1. Package structure comprising buffer layer for reducing thermal stress and method of forming the same

2. Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof

Career Highlights:

With an impressive total of 92 patents to his name, Tsung-Ding Wang has made significant contributions to the field of technology. His latest patents showcase his expertise in developing cutting-edge solutions for semiconductor packaging, focusing on enhancing performance and reducing thermal stress in electronic devices.

Collaborations:

Throughout his career, Tsung-Ding Wang has collaborated with esteemed colleagues such as Chien-Hsun Lee and Jung Wei Cheng. Together, they have worked on innovative projects at renowned companies such as Taiwan Semiconductor Manufacturing Company Ltd., contributing to advancements in semiconductor technology.

Conclusion:

In conclusion, Tsung-Ding Wang's innovative spirit and commitment to excellence have established him as a pioneering figure in the world of technology. His groundbreaking work in sustainable energy solutions and semiconductor packaging continues to shape the future of inventions, inspiring generations of innovators to come.

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