The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

May. 06, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Wei-Yu Chen, Hsinchu, TW;

Yu-Min Liang, Taoyuan, TW;

Hao-Cheng Hou, Hsinchu, TW;

Tsung-Ding Wang, Tainan, TW;

Chien-Hsun Lee, Hsin-chu County, TW;

Chung-Shi Liu, Hsinchu, TW;

Jung-Wei Cheng, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/073 (2006.01); G01R 1/02 (2006.01); G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 3/00 (2006.01); G01R 31/28 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07371 (2013.01); G01R 31/2886 (2013.01);
Abstract

A substrate structure includes a core substrate, a redistribution layer, a plurality of test pads, a first protective coating, at least one conductive pad and a passive device. The redistribution layer is disposed on and electrically connected to the core substrate. The test pads are disposed over the redistribution layer. The first protective coating is coated on the test pads. The conductive pad is d disposed on the redistribution layer aside the plurality of test pads. The passive device is disposed on and electrically connected to the at least one conductive pad.


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