Hao-Cheng Hou

Title: The Innovative Contributions of Hao-Cheng Hou in Semiconductor Technology

Introduction

Hao-Cheng Hou is a distinguished inventor based in Hsinchu, Taiwan, with a remarkable portfolio of 26 patents to his name. His innovations primarily focus on semiconductor packaging technology, which plays a crucial role in the advancement of electronics. Through his work, he has significantly contributed to enhancing the performance and reliability of semiconductor devices.

Latest Patents

Among Hao-Cheng Hou's latest patents are groundbreaking advancements in semiconductor packages and methods of forming them. One of his notable inventions describes a semiconductor package comprising a bare semiconductor chip, a packaged semiconductor chip positioned adjacent to the bare chip, and a redistribution structure that interconnects them. This structure includes multiple redistribution layers of varying thicknesses, designed to optimize the package's performance.

Another significant patent detailed a package structure that includes a buffer layer explicitly designed to reduce thermal stress during operation. In this design, a first and second die are encapsulated together, with the buffer layer strategically placed to mitigate stress effects between the encapsulants, further enhancing the durability and efficiency of the semiconductor devices.

Career Highlights

Hao-Cheng Hou has built his career working with prestigious institutions and companies. He has been associated with Taiwan Semiconductor Manufacturing Company Limited (TSMC), a global leader in semiconductor manufacturing, as well as National Tsing Hua University, renowned for its research and education in science and technology. His tenure at these organizations has allowed him to apply his innovative ideas while collaborating with other talented professionals in the field.

Collaborations

In his career, Hao-Cheng Hou has had the opportunity to work with several esteemed colleagues, including Tsung-Ding Wang and Chien-Hsun Lee. Their collaborative efforts have resulted in further advancements in semiconductor technology, contributing to more efficient and reliable electronic devices.

Conclusion

Hao-Cheng Hou's extensive work in semiconductor technologies has positioned him as a vital contributor to the field of electronics. Through his innovative patents and collaborations with leading companies and research institutions, he has made significant strides in improving semiconductor packaging methods. His dedication and expertise continue to inspire future innovations in the realm of technology.