The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2022
Filed:
Jan. 07, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Hao-Cheng Hou, Hsinchu, TW;
Wei-Yu Chen, Hsinchu, TW;
Jung-Wei Cheng, Hsinchu, TW;
Tsung-Ding Wang, Tainan, TW;
Chien-Hsun Lee, Hsin-chu County, TW;
Chung-Shi Liu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor package includes a first semiconductor die, a molded die, a third encapsulant, and a redistribution structure. The molded die includes a chip, a first encapsulant, and a second encapsulant. The first encapsulant laterally wraps the chip. The second encapsulant laterally wraps the first encapsulant. The third encapsulant laterally wraps the first semiconductor die and the molded die. The redistribution structure extends on the second encapsulant, the third encapsulant, and the first semiconductor die. The redistribution structure is electrically connected to the first semiconductor die and the molded die. The second encapsulant separates the first encapsulant from the third encapsulant.