This inventor holds 26 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2017-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017-2026
Areas of Expertise:
Title: Innovations of Jung-Wei Cheng: A Leader in Semiconductor Technology
Introduction
Jung-Wei Cheng is a prominent inventor based in Hsinchu, Taiwan, with a remarkable portfolio of 20 patents to his name. His work primarily focuses on electronic components and semiconductor technology, contributing significantly to advancements in these fields.
Latest Patents
Cheng's latest innovations include two pivotal patents. The first patent describes an electronic component that comprises a board, an electronic device, and a stiffening structure. This structure enhances the durability of the device by incorporating a ring portion around the edge of the board, supported by a core base and a cladding layer that protects the technology within.
The second innovation is a sophisticated semiconductor package that features a first semiconductor die equipped with a conductive post in a protective layer. This package is notable for its use of an encapsulant made of a unique material, complemented by a high-modulus dielectric layer and a redistribution structure. The intricate design, particularly the ratio of Young's modulus between materials, ensures superior performance in electronic applications.
Career Highlights
Jung-Wei Cheng is currently an integral part of the Taiwan Semiconductor Manufacturing Company Ltd., a leading entity in semiconductor manufacturing. His contributions have not only fostered innovations within the company but have also set benchmarks for the industry at large.
Collaborations
Throughout his career, Cheng has collaborated with several respected colleagues, including Tsung-Ding Wang and Hao-Cheng Hou. These partnerships have led to the successful development of cutting-edge technologies, further establishing Cheng’s reputation as a pioneer in the semiconductor field.
Conclusion
Jung-Wei Cheng's exemplary work and extensive patent portfolio underscore his significant role in advancing semiconductor technology. His innovative designs and effective collaborations continue to propel the industry forward, ensuring that Taiwan remains at the forefront of technological advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile