Taiwan Semiconductor Manufacturing Comp. Ltd.

Jung-Wei Cheng

Tsung-Ding Wang

Hao-Cheng Hou

Chien-Hsun Lee

Chung-Shi Liu

Yu-Min Liang

Hsin-Yu Pan

Chi-Yang Yu

Jiun-Yi Wu

Wei-Yu Chen

Yen-Fu Su

Chen-Hua Douglas Yu

Hung-Jui Kuo

Chih-Wei Lin

Ching-Hua Hsieh

Yu-Hsiang Hu

Meng-Tse Chen

Sih-Hao Liao

Wei-Chih Chen

Chin-Liang Chen

Hung-Jen Lin

Chien-Chang Lin

Sao-Ling Chiu

Chien-Hsun Chen

Yi-Yang Lei

Ping-Kang Huang

A semiconductor package includes a first integrated circuit, a first conductive via, a second conductive via, a second integrated circuit, a third conductive via and an encapsulant. The first conductive via is disposed in a first passivation layer over the first integrated circuit. The second conductive via is disposed in a second passivation layer over the first passivation layer. The second conductive via is electrically connected to the first conductive via. The third conductive via is disposed over the second integrated circuit, wherein a surface of the third conductive via is substantially coplanar with a surface of the third conductive via. The encapsulant encapsulates the first integrated circuit, the first passivation layer, the second passivation layer, the second integrated circuit and the third conductive via.

Semiconductor packages and method of manufacturing the same

A laminated structure and the manufacturing methods thereof are provided. The structure includes an interconnect substrate having a first surface and a second surface opposite to the first surface, an insulating encapsulant laterally wrapping the interconnect substrate, and a redistribution structure disposed on the first surface of the interconnect substrate and electrically connected with the interconnect substrate. The redistribution structure has a third surface facing the first surface and a fourth surface opposite to the third surface. The redistribution structure includes first pads, second pads located beside the first pads, and protective patterns disposed on the first pads and covering the first pads. The first pads include pad portions protruded from the fourth surface and the protective patterns are in contact with sidewalls and top surfaces of the pad portions of the first pads.

Laminated structure with pads and manufacturing method thereof

A package structure and a manufacturing method thereof are provided. The package structure includes an integrated substrate and a package component. The integrated substrate includes a substrate component laterally covered by an insulating encapsulation, a redistribution structure disposed over the substrate component and the insulating encapsulation, first conductive joints coupling the redistribution structure to the substrate component, and a buffer layer disposed on a lowermost dielectric layer of the redistribution structure and extending downwardly to cover an upper portion of each of the first conductive joints. A lower portion of each of the first conductive joints connected to the upper portion is covered by the insulating encapsulation. The package component disposed over and electrically coupled to the redistribution structure includes a semiconductor die laterally covered by an encapsulant.

Package structure and forming method thereof

A semiconductor package provided herein includes a package substrate and a semiconductor device. The package substrate includes a redistribution structure, an interconnect structure bonded to the interconnect structure and an insulation material laterally surrounding the interconnect structure, wherein the redistribution structure has a reduced structure and the insulation material fills the reduced structure. The semiconductor device is bonded to the package substrate. In addition, a method of fabricating a semiconductor package is also provided and includes a precut process forming the reduced structure in the redistribution structure of the package substrate.

Semiconductor package and methods of fabricating a semiconductor package

An electronic component includes a board, an electronic device, and a stiffening structure is provided. The electronic device is disposed on the board. The stiffening structure is disposed on the board. The stiffening structure includes a ring portion corresponding the edge of the board. The stiffening structure includes a core base and a cladding layer. The cladding layer covers the core base.

Electronic component and manufacturing method thereof

A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.

Semiconductor package

A substrate structure includes a core substrate, a redistribution layer, a plurality of test pads, a first protective coating, at least one conductive pad and a passive device. The redistribution layer is disposed on and electrically connected to the core substrate. The test pads are disposed over the redistribution layer. The first protective coating is coated on the test pads. The conductive pad is d disposed on the redistribution layer aside the plurality of test pads. The passive device is disposed on and electrically connected to the at least one conductive pad.

Probe card substrate, substrate structure and method of fabricating the same

A semiconductor structure includes a substrate component, an IC die component over the substrate component, and a composite redistribution structure interposed between and electrically coupled to the substrate and IC die components. The composite redistribution structure includes a local interconnect component between a first redistribution structure overlying the substrate component and a second redistribution structure underlying the IC die component, and an insulating encapsulation between the first and second redistribution structures and embedding the local interconnect component therein. The local interconnect component includes TSVs penetrating through a substrate and electrically coupled to first and second conductive connectors, the first conductive connectors between the first redistribution structure and a first side of the substrate, the second conductive connectors between the second redistribution structure and a second side of the substrate, and a first insulating layer between the first redistribution structure and the first side and laterally covering the first conductive connectors.

Semiconductor structure and forming method thereof

A semiconductor package includes a substrate, a semiconductor device, and a ring structure. The semiconductor device disposed on the substrate. The ring structure disposed on the substrate and surrounds the semiconductor device. The ring structure includes a first portion and a second portion. The first portion bonded to the substrate. The second portion connects to the first portion. A cavity is between the second portion and the substrate.

A semiconductor package includes a circuit board structure, a first redistribution layer structure and first bonding elements. The circuit board structure includes outermost first conductive patterns and a first mask layer adjacent to the outermost first conductive patterns. The first redistribution layer structure is disposed over the circuit board structure. The first bonding elements are disposed between and electrically connected to the first redistribution layer structure and the outermost first conductive patterns of the circuit board structure. In some embodiments, at least one of the first bonding elements covers a top and a sidewall of the corresponding outermost first conductive pattern.

Semiconductor packages and methods of forming the same

A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Package structure comprising buffer layer for reducing thermal stress and method of forming the same

A semiconductor package includes a semiconductor die, an encapsulant, a first and second dielectric layer, a through via, an extension pad, and a routing via. The semiconductor die includes a contact post. The first dielectric layer extends on the encapsulant. The through via extends through the first dielectric layer and has one end contacting the contact post. The extension pad is disposed on the first dielectric layer, contacting an opposite end of the through via with respect to the contact post. The extension pad has an elongated shape, a first end of the extension pad overlaps with the contact post and the through via, and a second end of the extension pad overlaps with the encapsulant. The second dielectric layer is disposed on the first dielectric layer and the extension pad. The routing via extends through the second dielectric layer to contact the second end of the extension pad.

Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof

A semiconductor package includes a first semiconductor die, a molded die, a third encapsulant, and a redistribution structure. The molded die includes a chip, a first encapsulant, and a second encapsulant. The first encapsulant laterally wraps the chip. The second encapsulant laterally wraps the first encapsulant. The third encapsulant laterally wraps the first semiconductor die and the molded die. The redistribution structure extends on the second encapsulant, the third encapsulant, and the first semiconductor die. The redistribution structure is electrically connected to the first semiconductor die and the molded die. The second encapsulant separates the first encapsulant from the third encapsulant.

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Hsinchu, Taiwan

Jung-Wei Cheng