The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
May. 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chi-Yang Yu, Taoyuan, TW;
Jung-Wei Cheng, Hsinchu, TW;
Yu-Min Liang, Taoyuan, TW;
Jiun-Yi Wu, Taoyuan, TW;
Yen-Fu Su, Hsinchu, TW;
Chien-Chang Lin, New Taipei, TW;
Hsin-Yu Pan, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor package includes a substrate, a semiconductor device, and a ring structure. The semiconductor device disposed on the substrate. The ring structure disposed on the substrate and surrounds the semiconductor device. The ring structure includes a first portion and a second portion. The first portion bonded to the substrate. The second portion connects to the first portion. A cavity is between the second portion and the substrate.