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Taoyuan, Taiwan

Chi-Yang Yu

USPTO Granted Patents = 41 (Patent Applications = 15)

Average Co-Inventor Count = 4.8

ph-index = 3

Forward Citations = 54(Granted Patents)

Location History:

Taoyuan County, TW (2017 - 2022)
Zhongli, TW (2018 - 2023)
Taoyuan, TW (2017 - 2024)

Company Filing History:

41 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2017-2025

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Areas of Expertise:

Semiconductor Packaging

Integrated Circuit Packages

Fan-Out Package Technology

Die Corner Removal

Underfill Crack Suppression

Planarization Techniques

Lid Structure Formation

Electronic Component Manufacturing

Package Structure Design

Manufacturing Methods

Semiconductor Structures

Flip Chip Packaging

41 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12417968 - Package structure and forming method thereof (2025-09-16),

2. 12412862 - Package structure and manufacturing method thereof (2025-09-09),

3. 12368112 - Electronic component and manufacturing method thereof (2025-07-22),

4. 12347802 - Die corner removal for underfill crack suppression in semiconductor die packaging (2025-07-01),

5. 12230589 - Semiconductor package (2025-02-18),

6. 12165946 - Semiconductor package and manufacturing method thereof (2024-12-10),

7. 12062604 - Semiconductor structure and manufacturing method thereof (2024-08-13),

8. 11855057 - Package structure and method of forming the same (2023-12-26),

9. 11824032 - Die corner removal for underfill crack suppression in semiconductor die packaging (2023-11-21),

10. 11784106 - Semiconductor package and manufacturing method thereof (2023-10-10),

11. 11749594 - Semiconductor structure and manufacturing method thereof (2023-09-05),

12. 11705408 - Semiconductor package (2023-07-18),

13. 11616037 - Integrated fan-out package and manufacturing method thereof (2023-03-28),

14. 11508640 - Semiconductor package and manufacturing method thereof (2022-11-22),

15. 11424220 - Semiconductor structure and manufacturing method thereof (2022-08-23),

Title: The Innovative Journey of Chi-Yang Yu

Introduction: Chi-Yang Yu, a distinguished inventor hailing from Taoyuan, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents: Chi-Yang Yu's latest patents include advancements in renewable energy technologies, smart home devices, and artificial intelligence systems, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Chi-Yang Yu has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing solutions that push the boundaries of what is possible. His work has not only earned him recognition within the industry but has also positively impacted the lives of many around the world.

Collaborations: Throughout his career, Chi-Yang Yu has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion: In conclusion, Chi-Yang Yu's passion for innovation, coupled with his technical expertise, has solidified his position as a trailblazer in the world of technology. His relentless pursuit of excellence and commitment to pushing the envelope continue to inspire inventors and entrepreneurs globally.

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