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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12368112 B1

PDFFull Text
Date of Patent:
Jul. 22, 2025

Filed:

Sep. 01, 2022

Electronic component and manufacturing method thereof

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chi-Yang Yu, Taoyuan, TW;

Jung-Wei Cheng, Hsinchu, TW;

Yu-Min Liang, Taoyuan, TW;

Chien-Hsun Lee, Hsin-chu County, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Peniel M Gumedzoe

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/165 (2013.01); H01L 23/49816 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/1616 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/1632 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/37001 (2013.01);
Abstract

An electronic component includes a board, an electronic device, and a stiffening structure is provided. The electronic device is disposed on the board. The stiffening structure is disposed on the board. The stiffening structure includes a ring portion corresponding the edge of the board. The stiffening structure includes a core base and a cladding layer. The cladding layer covers the core base.

Find Patent Forward Citations

Yu, Chi-Yang. (2025). Electronic component and manufacturing method thereof (U.S. Patent No. 12368112). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12368112

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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