Yen-Fu Su

Title: The Innovative Contributions of Yen-Fu Su

Introduction

Yen-Fu Su is a prominent inventor based in Hsinchu, Taiwan. With a total of four patents to his name, Su has made significant contributions to the field of semiconductor technology. His latest inventions demonstrate a commitment to advancing the efficiency and functionality of semiconductor packages.

Latest Patents

Yen-Fu Su's recent patents include innovative designs for semiconductor packages. One of his patents outlines a semiconductor package that consists of a substrate, a semiconductor device, and a ring structure. The unique configuration of the ring structure allows it to surround the semiconductor device, enhancing its performance and reliability. The design features a first portion that bonds to the substrate and a second portion that connects to the first, with a cavity formed between them.

Another significant patent focuses on a semiconductor package that includes through vias and stacked redistribution layers. This invention comprises a semiconductor die, an encapsulant, and multiple dielectric layers, while utilizing a routing via to improve connectivity. With strategic placements of extension pads and through vias, Su's design enhances the interaction between the semiconductor die and the surrounding layers, ultimately improving the overall efficiency of semiconductor packages.

Career Highlights

Yen-Fu Su currently works at Taiwan Semiconductor Manufacturing Company Ltd., a leading figure in the microelectronics sector. His role in this forward-thinking company has allowed him to contribute to groundbreaking technologies that shape the future of semiconductors. Su's technical expertise and innovative mindset have made him a vital asset in the ongoing quest for enhanced semiconductor solutions.

Collaborations

Throughout his career, Su has collaborated with esteemed colleagues such as Hsin-Yu Pan and Jung-Wei Cheng. Working alongside these talented individuals, he has been part of a team that pushes the boundaries of semiconductor technology, resulting in patent-worthy innovations that cater to contemporary industry needs.

Conclusion

Yen-Fu Su's contributions to semiconductor packaging technology have positioned him as a noteworthy inventor in the field. With four patents showcasing his talent for innovation, Su continues to drive advancements that benefit the semiconductor industry. His collaborations with skilled coworkers further amplify his impact, ensuring that his inventions contribute to more efficient and effective products in the marketplace.