IDiyas

For the Inventor, By the Inventor

Taipei, Taiwan

Hsin-Yu Pan

USPTO Granted Patents = 70 

Average Co-Inventor Count = 4.2

ph-index = 7

Forward Citations = 155(Granted Patents)

DiyaCoin DiyaCoin = 0.30 


Inventors with similar research interests:


Company Filing History:

goldMedal70 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2006-2025

where 'Filed Patents' based on already Granted Patents

70 patents (USPTO):
1. 12451426 - Conductive traces in semiconductor devices and methods of forming same (2025-10-21),
2. 12424571 - Package structure and manufacturing method thereof (2025-09-23),
3. 12418005 - Semiconductor package and manufacturing method thereof (2025-09-16),
4. 12406941 - Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same (2025-09-02),
5. 12400936 - Stacked memory cube with integrated thermal path for enhanced heat dissipation (2025-08-26),
6. 12388041 - Semiconductor package (2025-08-12),
7. 12362321 - Semiconductor package (2025-07-15),
8. 12362275 - Method of fabricating package structure including a plurality of antenna patterns (2025-07-15),
9. 12362270 - Package structure and method of fabricating the same (2025-07-15),
10. 12266648 - Package structure (2025-04-01),
11. 12255196 - Semiconductor package with thermal relaxation block and manufacturing method thereof (2025-03-18),
12. 12230589 - Semiconductor package (2025-02-18),
13. 12218021 - Semiconductor packages and methods of forming the same (2025-02-04),
14. 12021024 - Semiconductor device including a semiconductor die and a plurality of antenna patterns (2024-06-25),
15. 12014992 - Semiconductor package (2024-06-18),

Title: Hsin-Yu Pan: Pioneering Innovations in Semiconductor Technologies

Introduction: Hsin-Yu Pan, a prominent inventor based in Taipei, TW, has made significant contributions to the world of technology with his relentless dedication to innovation. His impressive portfolio includes 54 patents, showcasing his expertise in semiconductor technologies.

Latest Patents: Among his latest patents is a groundbreaking Package Structure and Manufacturing Method, involving innovative elements such as waveguide structures and antennas. Another notable invention is the Semiconductor Package with Through Vias and Stacked Redistribution Layers, demonstrating Pan's mastery in semiconductor packaging techniques.

Career Highlights: Pan has a rich history of working with leading companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company Ltd. (TSMC). His experience and expertise have been pivotal in the development of cutting-edge semiconductor solutions that have reshaped the industry.

Collaborations: Throughout his career, Pan has collaborated with esteemed colleagues such as Sen-Kuei Hsu and Han-Ping Pu. Together, they have pushed the boundaries of innovation and set new standards in semiconductor technologies.

Conclusion: Hsin-Yu Pan's visionary approach to innovation and his deep commitment to excellence have established him as a trailblazer in the field of technology. His groundbreaking inventions and collaborations continue to drive progress and shape the future of semiconductor technologies.

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