Hsin-Yu Pan

This inventor holds 77 USPTO granted patents and 20 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2006-2026.

USPTO Granted Patents = 77 (Patent Applications = 20)

% Patents Active = 85.7

Average Co-Inventor Count = 4.3

ph-index = 7

Forward Citations = 175(Granted Patents)

Forward Citations (Not Self Cited) = 137(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

74 out of 42,711

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

3 out of 450

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2006-2026

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Areas of Expertise:

Integrated Circuit

Package Structure

Semiconductor Device

Thermal Management

3D Stacking

Conductive Traces

Antenna Patterns

Thermal Conductive Block

Heat Dissipation

Manufacturing Method

Three-Dimensional IC

Thermal Through Vias

77 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12708045 - Method and structure for a three-dimensional package (2026-08-11),

2. 12642111 - Package structure (2026-05-26),

3. 12604734 - Integrated circuit packages and methods (2026-04-14),

4. 12599018 - Package structure with enhancement structure and manufacturing method thereof (2026-04-07),

5. 12588549 - Integrated circuit package and method (2026-03-24),

6. 12568849 - Dam for three-dimensional integrated circuit (2026-03-03),

7. 12557681 - Semiconductor package and method of manufacturing the same (2026-02-17),

8. 12451426 - Conductive traces in semiconductor devices and methods of forming same (2025-10-21),

9. 12424571 - Package structure and manufacturing method thereof (2025-09-23),

10. 12418005 - Semiconductor package and manufacturing method thereof (2025-09-16),

11. 12406941 - Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same (2025-09-02),

12. 12400936 - Stacked memory cube with integrated thermal path for enhanced heat dissipation (2025-08-26),

13. 12388041 - Semiconductor package (2025-08-12),

14. 12362321 - Semiconductor package (2025-07-15),

15. 12362275 - Method of fabricating package structure including a plurality of antenna patterns (2025-07-15),

Title: Hsin-Yu Pan: Pioneering Innovations in Semiconductor Technologies

Introduction: Hsin-Yu Pan, a prominent inventor based in Taipei, TW, has made significant contributions to the world of technology with his relentless dedication to innovation. His impressive portfolio includes 54 patents, showcasing his expertise in semiconductor technologies.

Latest Patents: Among his latest patents is a groundbreaking Package Structure and Manufacturing Method, involving innovative elements such as waveguide structures and antennas. Another notable invention is the Semiconductor Package with Through Vias and Stacked Redistribution Layers, demonstrating Pan's mastery in semiconductor packaging techniques.

Career Highlights: Pan has a rich history of working with leading companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company Ltd. (TSMC). His experience and expertise have been pivotal in the development of cutting-edge semiconductor solutions that have reshaped the industry.

Collaborations: Throughout his career, Pan has collaborated with esteemed colleagues such as Sen-Kuei Hsu and Han-Ping Pu. Together, they have pushed the boundaries of innovation and set new standards in semiconductor technologies.

Conclusion: Hsin-Yu Pan's visionary approach to innovation and his deep commitment to excellence have established him as a trailblazer in the field of technology. His groundbreaking inventions and collaborations continue to drive progress and shape the future of semiconductor technologies.