The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2022
Filed:
May. 08, 2020
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Hao-Cheng Hou, Hsinchu, TW;
Chien-Hsun Lee, Hsin-chu County, TW;
Chung-Shi Liu, Hsinchu, TW;
Jung-Wei Cheng, Hsinchu, TW;
Tsung-Ding Wang, Tainan, TW;
Yi-Yang Lei, Taichung, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor package includes semiconductor dies, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The encapsulant encapsulates the semiconductor dies and is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the semiconductor dies. The high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer. The redistribution structure includes conductive patterns embedded in at least a pair of dielectric layers. The dielectric layers of the pair are made of a third material. The elastic modulus of the first material is higher than the elastic modulus of the third material. The elastic modulus of the second material is higher than the elastic modulus of the third material.