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For the Inventor, By the Inventor

Taichung, Taiwan

Yi-Yang Lei

USPTO Granted Patents = 23 

Average Co-Inventor Count = 6.3

ph-index = 3

Forward Citations = 51(Granted Patents)


Location History:

  • Wuqi Township, TW (2012 - 2013)
  • Wuqi Township, Taichung County, TW (2014)
  • Taichung, TW (2017 - 2024)

Company Filing History:

goldMedal23 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2012-2025

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23 patents (USPTO):
1. 12441097 - Lamination process, and manufacturing method of semiconductor package using a chuck (2025-10-14),
2. 12391033 - Lamination process, and manufacturing method of semiconductor package using a chuck (2025-08-19),
3. 12381176 - Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer (2025-08-05),
4. 12051666 - Package structure and manufacturing method of package structure thereof (2024-07-30),
5. 11993066 - Chuck, lamination process, and manufacturing method of semiconductor package using the same (2024-05-28),
6. 11878388 - Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same (2024-01-23),
7. 11742317 - Process including a re-etching process for forming a semiconductor structure (2023-08-29),
8. 11587902 - Semiconductor structure and method of forming the same (2023-02-21),
9. 11569183 - Package structure and method of fabricating the same (2023-01-31),
10. 11355466 - Package structure and manufacturing method of package structure thereof (2022-06-07),
11. 11270921 - Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof (2022-03-08),
12. 11069652 - Method of manufacturing semiconductor structure (2021-07-20),
13. 10867939 - Package structure and method of fabricating the same (2020-12-15),
14. 10790252 - Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices (2020-09-29),
15. 10535629 - Method of manufacturing semiconductor structure (2020-01-14),

Title: Innovations by Yi-Yang Lei: Pioneering Advances in Semiconductor Packaging

Introduction: Yi-Yang Lei, a distinguished inventor based in Taichung, Taiwan, has made significant strides in the field of semiconductor packaging. With an impressive portfolio of 20 patents, he continues to contribute valuable innovations that enhance the efficiency and performance of electronic devices.

Latest Patents: Among his latest inventions is a patent titled "Package structure and manufacturing method of package structure thereof." This invention provides a comprehensive package structure that includes at least one semiconductor die along with a redistribution structure. The semiconductor die is laterally encapsulated by an encapsulant, while the redistribution structure is positioned on both the semiconductor die and the encapsulant, ensuring electrical connectivity. The structure features signal lines with specific configurations and repair lines designed to enhance functionality. Another notable patent is the "Chuck, lamination process, and manufacturing method of semiconductor package using the same." This lamination chuck is designed for the efficient lamination of film materials, incorporating a top layer made of polymeric material to optimize the manufacturing process.

Career Highlights: Yi-Yang Lei currently works at Taiwan Semiconductor Manufacturing Company (TSMC), a leader in the semiconductor industry renowned for its cutting-edge innovations. His contributions to TSMC have bolstered the company's reputation for developing advanced technologies that drive the future of electronics.

Collaborations: In his innovative journey, Yi-Yang collaborates with esteemed colleagues such as Chung-Shi Liu and Chen-Hua Douglas Yu, enhancing the scope of his research and development efforts. Together, they explore new frontiers in semiconductor technology, contributing to groundbreaking advancements.

Conclusion: Yi-Yang Lei's work exemplifies the spirit of innovation within the semiconductor industry. His patents reflect a commitment to improving manufacturing techniques and package structures, ultimately pushing the boundaries of what is possible in electronics. With continued collaboration and dedication to research, Yi-Yang Lei is poised to remain an influential figure in the realm of semiconductor advancements.

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