The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2024
Filed:
Jun. 15, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/26 (2012.01); B24B 37/16 (2012.01); B24D 11/04 (2006.01); B24B 37/22 (2012.01); B24B 37/24 (2012.01); B24B 7/22 (2006.01); H01L 21/321 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/687 (2006.01); B24D 13/14 (2006.01);
U.S. Cl.
CPC ...
B24B 37/22 (2013.01); B24B 7/228 (2013.01); B24B 37/245 (2013.01); B24B 37/26 (2013.01); B24D 11/04 (2013.01); B24D 13/142 (2013.01); H01L 21/3212 (2013.01); H01L 21/486 (2013.01); H01L 21/68764 (2013.01); H01L 24/08 (2013.01); H01L 2224/02372 (2013.01);
Abstract
A polishing pad, a polishing apparatus and a method of manufacturing a semiconductor package using the same are provided. In some embodiments, a polishing pad includes a sub-pad portion and a top pad portion over the sub-pad portion. The top pad portion includes a plurality of grooves having a first width and a plurality of openings having a second width different from the first width, and the openings are located in a center zone of the polishing pad.