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For the Inventor, By the Inventor

Hsinchu, Taiwan

Jung Wei Cheng

This inventor holds 54 USPTO granted patents and 12 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jung Wei Cheng. Retrieved from https://idiyas.com/inventor/jung-wei-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 54 

% Patents Active = 87.0

Average Co-Inventor Count = 4.9

ph-index = 9

Forward Citations = 2,096(Granted Patents)


Location History:

  • Sinpu Township, TW (2021)
  • Hsinchu, TW (2014 - 2022)

Company Filing History:

goldMedal49 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal5 out of 491 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2014-2026

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Areas of Expertise:
Semiconductor Packaging
3D Integrated Circuits
Thermal Performance
Substrate Design
Molded Underfilling
Connector Formation
Planarization
Package-on-Package
Redistribution Structures
Die Stacking
Integrated Circuit Packages
Manufacturing Methods
54 patents (USPTO):Explore Patents
1. 12727177 - Package with integrated voltage regulator and method forming the same (2026-09-01),
2. 12720775 - Packages with chips comprising inductor-vias and methods forming the same (2026-08-25),
3. 12685236 - Semiconductor device packages and methods of forming the same (2026-07-14),
4. 12660646 - Semiconductor package and method of forming the same (2026-06-16),
5. 12635554 - Integrated circuit packages and methods of forming same (2026-05-19),
6. 12635507 - Connector formation methods and packaged semiconductor devices (2026-05-19),
7. 12588525 - Packaging substrate including an underfill injection opening and methods of forming the same (2026-03-24),
8. 12568849 - Dam for three-dimensional integrated circuit (2026-03-03),
9. 12142560 - Semiconductor packages and methods of forming same (2024-11-12),
10. 11424199 - Connector formation methods and packaged semiconductor devices (2022-08-23),
11. 11387118 - Integrated circuit packages and methods of forming same (2022-07-12),
12. 11158614 - Thermal performance structure for semiconductor packages and method of forming same (2021-10-26),
13. 11139281 - Molded underfilling for package on package devices (2021-10-05),
14. 11127644 - Planarization of semiconductor packages and structures resulting therefrom (2021-09-21),
15. 11101209 - Redistribution structures in semiconductor packages and methods of forming same (2021-08-24),

Title: Jung Wei Cheng - Innovative Inventor from Hsin-Chu

Introduction: Jung Wei Cheng is a renowned inventor hailing from Hsin-Chu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Jung Wei Cheng holds several patents in various technological domains, showcasing his versatility and expertise in inventing cutting-edge solutions for modern challenges.

Career Highlights: Throughout his illustrious career, Jung Wei Cheng has consistently pushed the boundaries of innovation, with his inventions revolutionizing industries and improving the lives of many around the world.

Collaborations: Jung Wei Cheng has collaborated with leading tech companies, research institutions, and universities, harnessing collective expertise to bring forth groundbreaking inventions that have left a lasting impact on the world of technology.

Conclusion: Jung Wei Cheng's dedication to innovation and his relentless pursuit of excellence have solidified his position as a trailblazing inventor, inspiring the next generation of innovators to push the boundaries of what is possible in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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