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Hsin-Chu, Taiwan

Jung Wei Cheng

USPTO Granted Patents = 46 (Patent Applications = 17)

Average Co-Inventor Count = 4.7

ph-index = 9

Forward Citations = 1,906(Granted Patents)

Location History:

Sinpu Township, TW (2021)
Hsinchu, TW (2014 - 2022)

Company Filing History:

46 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2014-2024

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Areas of Expertise:

Semiconductor Packages

Integrated Circuit Packages

Thermal Performance Structure

Molded Underfilling

Substrate Design

3D Integrated Circuit

Connector Formation

Package-on-Package Structure

Planarization Techniques

Device Thermal Characteristics

Underfill Dispensing

Concentric Bump Design

46 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12142560 - Semiconductor packages and methods of forming same (2024-11-12),

2. 11424199 - Connector formation methods and packaged semiconductor devices (2022-08-23),

3. 11387118 - Integrated circuit packages and methods of forming same (2022-07-12),

4. 11158614 - Thermal performance structure for semiconductor packages and method of forming same (2021-10-26),

5. 11139281 - Molded underfilling for package on package devices (2021-10-05),

6. 11127644 - Planarization of semiconductor packages and structures resulting therefrom (2021-09-21),

7. 11101209 - Redistribution structures in semiconductor packages and methods of forming same (2021-08-24),

8. 10867949 - Substrate design for semiconductor packages and method of forming same (2020-12-15),

9. 10867878 - Dam for three-dimensional integrated circuit (2020-12-15),

10. 10777467 - Semiconductor structure and manufacturing method thereof (2020-09-15),

11. 10714359 - Substrate design for semiconductor packages and method of forming same (2020-07-14),

12. 10522486 - Connector formation methods and packaged semiconductor devices (2019-12-31),

13. 10522436 - Planarization of semiconductor packages and structures resulting therefrom (2019-12-31),

14. 10468307 - Semiconductor structure and manufacturing method thereof (2019-11-05),

15. 10319607 - Package-on-package structure with organic interposer (2019-06-11),

Title: Jung Wei Cheng - Innovative Inventor from Hsin-Chu

Introduction: Jung Wei Cheng is a renowned inventor hailing from Hsin-Chu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Jung Wei Cheng holds several patents in various technological domains, showcasing his versatility and expertise in inventing cutting-edge solutions for modern challenges.

Career Highlights: Throughout his illustrious career, Jung Wei Cheng has consistently pushed the boundaries of innovation, with his inventions revolutionizing industries and improving the lives of many around the world.

Collaborations: Jung Wei Cheng has collaborated with leading tech companies, research institutions, and universities, harnessing collective expertise to bring forth groundbreaking inventions that have left a lasting impact on the world of technology.

Conclusion: Jung Wei Cheng's dedication to innovation and his relentless pursuit of excellence have solidified his position as a trailblazing inventor, inspiring the next generation of innovators to push the boundaries of what is possible in the world of technology.

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