The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Jan. 05, 2023
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Hao-Cheng Hou, Hsinchu, TW;
Tsung-Ding Wang, Tainan, TW;
Jung Wei Cheng, Hsinchu, TW;
Chien-Hsun Lee, Chu-tung Town, TW;
Shang-Yun Hou, Jubei City, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A method includes forming an inductor die, which includes forming a metal via over a substrate, forming a magnetic shell encircling the metal via, with the metal via and the magnetic shell collectively forming an inductor, and depositing a dielectric layer around the magnetic shell. The method further includes placing the inductor die over a carrier, encapsulating the inductor die in an encapsulant, forming redistribution lines electrically connecting to the inductor, and bonding a device die to the redistribution lines. The device die is electrically coupled to the inductor through the redistribution lines.