The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2021
Filed:
Aug. 01, 2018
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chung-Shi Liu, Hsinchu, TW;
Chien-Hsun Lee, Chu-tung Town, TW;
Jiun Yi Wu, Zhongli, TW;
Hao-Cheng Hou, Hsinchu, TW;
Hung-Jen Lin, Tainan, TW;
Jung Wei Cheng, Hsinchu, TW;
Tsung-Ding Wang, Tainan, TW;
Yu-Min Liang, Zhongli, TW;
Li-Wei Chou, Taoyuan, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.