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For the Inventor, By the Inventor

Tainan, Taiwan

Hung-Jen Lin

This inventor holds 29 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2003-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hung-Jen Lin. Retrieved from https://idiyas.com/inventor/hung-jen-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 93.1

Average Co-Inventor Count = 5.2

ph-index = 6

Forward Citations = 160(Granted Patents)


Location History:

  • Hsin-Chu, TW (2017)
  • Tainan, TW (2003 - 2022)

Company Filing History:

goldMedal29 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2003-2026

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Areas of Expertise:
Connector Formation
Semiconductor Packages
Hybrid Bonding
Post-Passivation Interconnect
Integrated Fan-Out
Wafer Level Packaging
Substrate Design
Copper Electrochemical Plating
Package Assembly
Redistribution Structures
Thermal Management
Metal Deposition
29 patents (USPTO):Explore Patents
1. 12635507 - Connector formation methods and packaged semiconductor devices (2026-05-19),
2. 12494434 - Semiconductor packages and method of manufacturing the same (2025-12-09),
3. 12142560 - Semiconductor packages and methods of forming same (2024-11-12),
4. 11424199 - Connector formation methods and packaged semiconductor devices (2022-08-23),
5. 11101209 - Redistribution structures in semiconductor packages and methods of forming same (2021-08-24),
6. 10867957 - Mechanisms for forming hybrid bonding structures with elongated bumps (2020-12-15),
7. 10777431 - Post-passivation interconnect structure and method of forming the same (2020-09-15),
8. 10665565 - Package assembly (2020-05-26),
9. 10651055 - Post-passivation interconnect structure and method of forming the same (2020-05-12),
10. 10522486 - Connector formation methods and packaged semiconductor devices (2019-12-31),
11. 10483132 - Post-passivation interconnect structure and method of forming the same (2019-11-19),
12. 10192848 - Package assembly (2019-01-29),
13. 10163846 - Mechanisms for forming hybrid bonding structures with elongated bumps (2018-12-25),
14. 10074604 - Integrated fan-out package and method of fabricating the same (2018-09-11),
15. 10026671 - Substrate design for semiconductor packages and method of forming same (2018-07-17),

Title: The Innovative Journey of Inventor Hung-Jen Lin

Introduction: Hung-Jen Lin, a talented inventor hailing from Tainan, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Hung-Jen Lin holds several patents in various technological domains, showcasing his versatility and creativity in innovation.

Career Highlights: Throughout his illustrious career, Hung-Jen Lin has been at the forefront of technological advancements, consistently pushing the boundaries of what is possible. His dedication to innovation has led to the development of cutting-edge solutions that have revolutionized industries.

Collaborations: Hung-Jen Lin has collaborated with leading tech companies, research institutions, and universities to further his research and bring his inventions to life. His collaborative spirit and passion for innovation have been instrumental in his success.

Conclusion: Hung-Jen Lin's innovative spirit, coupled with his determination to make a difference, has solidified his position as a respected inventor in the technology sector. His contributions continue to inspire future generations of inventors to push the limits of creativity and drive positive change through innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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