The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Apr. 28, 2017
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Hao-Cheng Hou, Hsinchu, TW;
Chien-Hsun Lee, Hsin-chu County, TW;
Hung-Jen Lin, Tainan, TW;
Jung-Wei Cheng, Hsinchu, TW;
Tsung-Ding Wang, Tainan, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A method of fabricating an integrated fan-out package is provided. The method includes the followings. An integrated circuit component is mounted on a carrier. An insulating encapsulation is formed on the carrier to encapsulate sidewalls of the integrated circuit component. A plurality of conductive pillars are formed on the integrated circuit component and a dielectric layer is formed to cover the integrated circuit component and the insulating encapsulation, wherein the plurality of conductive pillars penetrate through the dielectric layer and are electrically connected to the integrated circuit component. A redistribution circuit structure is formed on the dielectric layer and the plurality of conductive pillars, wherein the redistribution circuit structure is electrically connected to the integrated circuit component through the plurality of conductive pillars, and the redistribution circuit structure and the insulating encapsulation are spaced apart by the dielectric layer.