The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
Aug. 29, 2014
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Mirng-Ji Lii, Sinpu Township, TW;
Chien-Hsun Lee, Chu-tung Town, TW;
Tsung-Ding Wang, Tainan, TW;
Jung Wei Cheng, Hsin-Chu, TW;
Ming-Che Liu, Hsin-Chu, TW;
Hao-Cheng Hou, Hsin-Chu, TW;
Hung-Jen Lin, Tainan, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
An embodiment device package includes first die and one or more redistribution layers (RDLs) electrically connected to the first die. The one or more RDLs extend laterally past edges of the first die. The device package further includes one or more second dies bonded to a first surface of the one or more RDLs and a connector element on the first surface of the one or more RDLs. The connector element has a vertical dimension greater than the one or more second dies. A package substrate is bonded to the one or more RDLs using the connector element, wherein the one or more second dies is disposed between the first die and the package substrate.