The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Sep. 22, 2017
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Hung-Jen Lin, Tainan, TW;

Tsung-Ding Wang, Tainan, TW;

Chien-Hsiun Lee, Chu-Tung Town, TW;

Wen-Hsiung Lu, Jhonghe, TW;

Ming-Da Cheng, Jhubei, TW;

Chung-Shi Liu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 21/566 (2013.01); H01L 21/768 (2013.01); H01L 23/3114 (2013.01); H01L 23/3171 (2013.01); H01L 24/11 (2013.01); H01L 23/525 (2013.01); H01L 24/02 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/94 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/03612 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05187 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05681 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/21 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/27416 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/94 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01); H01L 2924/2076 (2013.01);
Abstract

In some embodiments, the present disclosure relates to a package assembly having a bump on a first substrate. A molding compound is on the first substrate and contacts sidewalls of the bump. A no-flow underfill layer is on a conductive region of a second substrate. The no-flow underfill layer and the conductive region contact the bump. A mask layer is arranged on the second substrate and laterally surrounds the no-flow underfill layer. The no-flow underfill layer contacts the substrate between the conductive region and the mask layer.


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