Clinton Chao

This inventor holds 27 USPTO granted patents and 1 published patent application, primarily in Integrated Circuit Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2006-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Clinton Chao. Retrieved from https://idiyas.com/inventor/clinton-chao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 (Patent Applications = 1)

% Patents Active = 51.9

Average Co-Inventor Count = 3.5

ph-index = 10

Forward Citations = 502(Granted Patents)

Location History:

Hsinchu, TW (2006 - 2013)
Redwood Shores, CA (US) (2013 - 2021)

Company Filing History:

27 out of 42,872

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2006-2021

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Areas of Expertise:

Integrated Circuit

Stress Tuning Layer

Wafer-Level Assembly

Semiconductor Interposer

Thin Substrate

Stacked Structures

Flip-Chip Assembly

Through-Silicon Vias

Probe Card Structure

System in Package

Electromagnetic Shielding

Multi-Layer Interconnects

27 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11094646 - Methods of manufacturing an integrated circuit having stress tuning layer (2021-08-17),

2. 10269730 - Methods of manufacturing an integrated circuit having stress tuning layer (2019-04-23),

3. 9633954 - Methods of manufacturing an integrated circuit having stress tuning layer (2017-04-25),

4. 9275948 - Integrated circuit having stress tuning layer (2016-03-01),

5. 8945998 - Programmable semiconductor interposer for electronic package and method of forming (2015-02-03),

6. 8704383 - Silicon-based thin substrate and packaging schemes (2014-04-22),

7. 8551813 - Wafer level IC assembly method (2013-10-08),

8. 8476735 - Programmable semiconductor interposer for electronic package and method of forming (2013-07-02),

9. 8426256 - Method of forming stacked-die packages (2013-04-23),

10. 8367474 - Method of manufacturing integrated circuit having stress tuning layer (2013-02-05),

11. 8334170 - Method for stacking devices (2012-12-18),

12. 8247267 - Wafer level IC assembly method (2012-08-21),

13. 8232183 - Process and apparatus for wafer-level flip-chip assembly (2012-07-31),

14. 8174129 - Silicon-based thin substrate and packaging schemes (2012-05-08),

15. 7977155 - Wafer-level flip-chip assembly methods (2011-07-12),

Title: **Clinton Chao: Innovating Integrated Circuit Manufacturing**

Introduction

Clinton Chao is an accomplished inventor based in Hsinchu, Taiwan, known for his significant contributions to the field of integrated circuit manufacturing. With an impressive portfolio of 27 patents, Chao has demonstrated his expertise and commitment to advancing technology in the semiconductor industry.

Latest Patents

One of Clinton Chao's latest patents focuses on methods of manufacturing an integrated circuit featuring a stress tuning layer. This innovation addresses the common issue of warpage and breakage in integrated circuit substrates by mitigating the stress exerted by thin films on the substrate's surface. Notably advantageous for substrates thinner than 150 micrometers, the stress-tuning layer is instrumental in balancing stress within the substrate, preventing undesirable bending. Additionally, the design incorporates multiple bonding pads on one surface, allowing for efficient electrical connections to other components.

Career Highlights

Chao's career has been marked by his association with Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leading entity in the semiconductor sector. His work at TSMC has led to numerous innovations that enhance manufacturing processes and improve product reliability in the highly competitive landscape of technology.

Collaborations

Throughout his career, Clinton Chao has collaborated with distinguished professionals like Tjandra Winata Karta and Mark Shane Peng. These collaborations have fostered innovation and creativity, resulting in groundbreaking advancements in integrated circuit technology and manufacturing techniques.

Conclusion

Clinton Chao stands out as a pivotal inventor in the semiconductor industry, with his substantial number of patents and innovative contributions shaping the future of integrated circuits. His ongoing work at TSMC and his collaboration with accomplished colleagues reflect his dedication to advancing technology and fostering ingenuity in the field.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: