The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Apr. 20, 2012
Szu-wei LU, Hsin-Chu, TW;
Clinton Chao, Redwood Shores, CA (US);
Ann Luh, Hsin-Chu, TW;
Tjandra Winata Karta, Hsinchu, TW;
Jerry Tzou, Hsin-Chu, TW;
Kuo-chin Chang, Chiayi, TW;
Szu-Wei Lu, Hsin-Chu, TW;
Clinton Chao, Redwood Shores, CA (US);
Ann Luh, Hsin-Chu, TW;
Tjandra Winata Karta, Hsinchu, TW;
Jerry Tzou, Hsin-Chu, TW;
Kuo-Chin Chang, Chiayi, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A silicon-based thin package substrate is used for packaging semiconductor chips. The silicon-based thin package substrate preferably has a thickness of less than about 200 μm. A plurality of traces is formed in the silicon-based thin package substrate, connecting BGA balls and solder bumps. A semiconductor chip may be mounted on the solder bumps. The silicon-based thin package substrate may be used as a carrier of semiconductor chips.