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For the Inventor, By the Inventor

Chiayi, Taiwan

Kuo-Chin Chang

USPTO Granted Patents = 32 

Average Co-Inventor Count = 4.1

ph-index = 4

Forward Citations = 136(Granted Patents)


Location History:

  • HsinChu, TW (2007 - 2015)
  • Chiayi, TW (2013 - 2024)

Company Filing History:

goldMedal32 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2007-2025

where 'Filed Patents' based on already Granted Patents

32 patents (USPTO):
1. 12482766 - MIMcap corner structures in the keep-out zones of a semiconductor die and methods of forming the same (2025-11-25),
2. 12476211 - Semiconductor device (2025-11-18),
3. 12094792 - Package structure having lid with protrusion and manufacturing method thereof (2024-09-17),
4. 12021048 - Semiconductor device (2024-06-25),
5. 12009327 - Semiconductor die (2024-06-11),
6. 11855022 - Shielding structures (2023-12-26),
7. 11848270 - Chip structure and method for forming the same (2023-12-19),
8. 11532583 - Semiconductor structure and manufacturing method thereof (2022-12-20),
9. 11495556 - Semiconductor structure having counductive bump with tapered portions and method of manufacturing the same (2022-11-08),
10. 11450588 - Method for forming chip package structure with heat conductive layer (2022-09-20),
11. 11380639 - Shielding structures (2022-07-05),
12. 11222859 - Semiconductor device structure with bonding pad and method for forming the same (2022-01-11),
13. 11189538 - Semiconductor structure with polyimide packaging and manufacturing method (2021-11-30),
14. 11145564 - Multi-layer passivation structure and method (2021-10-12),
15. 11127704 - Semiconductor device with bump structure and method of making semiconductor device (2021-09-21),

Title: Kuo-Chin Chang: Innovator in Semiconductor Technology

Introduction

Kuo-Chin Chang, a prominent inventor located in Chiayi, Taiwan, has made significant contributions to semiconductor technology, evidenced by his impressive portfolio of 30 patents. His innovative ideas have transformed various aspects of semiconductor packaging and design, showcasing his expertise and dedication to this critical field.

Latest Patents

Among his latest patents is a groundbreaking package structure featuring a lid with a protrusion, designed for efficient manufacture and enhanced performance. This semiconductor package consists of a substrate, a semiconductor die, a lid, and an adhesive layer. The innovative adhesive layer incorporates both a metallic thermal interface material (TIM) layer and a polymeric TIM layer, optimizing heat dissipation and reliability. Another notable patent details a semiconductor device that includes a semiconductor die, conductive pads, and connector structures, designed to improve connectivity and functionality in semiconductor applications.

Career Highlights

Kuo-Chin Chang's career is marked by his tenure at Taiwan Semiconductor Manufacturing Company Ltd., where he has played a pivotal role in the development of cutting-edge semiconductor solutions. His extensive experience and knowledge in the industry have positioned him as a leading figure in semiconductor innovations.

Collaborations

Throughout his career, Chang has collaborated with esteemed colleagues such as Pei-Haw Tsao and Mirng-Ji Lii. These partnerships have fostered a creative environment that has led to prolific advancements in technology and product development within the semiconductor sector.

Conclusion

Kuo-Chin Chang exemplifies the spirit of innovation in the semiconductor industry. With 30 patents to his name and several groundbreaking inventions, he continues to influence the future of technology at Taiwan Semiconductor Manufacturing Company Ltd. His work not only showcases his brilliance as an inventor but also highlights the importance of collaboration in achieving remarkable advancements in the field.

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