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Years Active: 2001-2025
Title: Szu-Wei Lu: Innovating the Future with 170 Patents
Introduction:
Szu-Wei Lu, a prolific inventor hailing from Hsinchu, Taiwan, has made significant contributions to the fields of package components, electronic devices, and manufacturing methods. With an impressive portfolio of 170 patents and a track record of working with renowned organizations, Lu stands as a leading innovator in his field. In this article, we explore some of Lu's latest patents, highlight his career achievements, and shed light on his valuable collaborations.
Latest Patents:
Lu's recent patents showcase his expertise in package components, electronic devices, and manufacturing methods. One notable invention is the "Package Component, Electronic Device, and Manufacturing Method Thereof." This patent describes a package component comprising a molding layer, redistribution structures, a semiconductor die, and a through interlayer via (TIV). The unique feature of this innovation lies in the difference in hardness between the molding layer and the insulating layer, providing enhanced protection to the device package.
Another significant patent is titled "Package Structure with Underfill." This invention introduces a package structure that includes a substrate, a stack of semiconductor dies, an underfill element, and a protective film. The underfill element acts as a separator between the protective film and the semiconductor dies, thereby ensuring improved durability and reliability of the package structure.
Career Highlights:
Throughout his career, Lu has worked with esteemed organizations in the technology and research sector. Notably, he has contributed to the success of Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leading semiconductor company known for its cutting-edge manufacturing processes. Lu's expertise has played a vital role in advancing TSMC's technological capabilities and bolstering its competitive edge in the industry.
Additionally, Lu has collaborated with the Industrial Technology Research Institute (ITRI), a renowned research organization in Taiwan. His contributions to ITRI have paved the way for technological advancements and facilitated the translation of innovative ideas into practical applications.
Collaborations:
Lu's pursuit of innovation has been strengthened by collaborations with talented individuals in his field. Two notable coworkers include Jing-Cheng Lin and Ying-Ching Shih. These collaborations have fostered an environment of knowledge-sharing, experimentation, and creative problem-solving, leading to groundbreaking developments in the realm of electronic devices and manufacturing methods.
Conclusion:
Szu-Wei Lu's impressive portfolio of 170 patents, encompassing package components, electronic devices, and manufacturing methods, solidifies his position as a trailblazing innovator. His contributions have not only resulted in technological advancements but have also strengthened the competitive landscape of the organizations he has worked with, including TSMC and ITRI. With a commitment to excellence and a drive for pushing the boundaries of innovation, Szu-Wei Lu continues to play a pivotal role in shaping the future of the industry.
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